Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device Number:7,410,826 from the United States Patent and Trademark Office (PTO) owispatent A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.<H manufacturing, electronic, Apparatus, for, m, 7410826.html, Patent, pto, 7410826

Title: Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device

Abstract: A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.

Patent Number: 7,410,826 Issued on 08/12/2008 to Shiozawa

Inventors: Shiozawa; Masakuni (Suwa, JP)
Assignee: Seiko Epson Corporation (JP)

Appl. No.: 11/313,055

Filed: December 20, 2005

Related U.S. Patent Documents


Application Number	Filing Date	Patent Number	Issue Date
10394478	Mar., 2003	7017636

Foreign Application Priority Data


Mar 22, 2002 [JP]			2002-081220
Mar 22, 2002 [JP]			2002-081221
Mar 22, 2002 [JP]			2002-081222
Mar 22, 2002 [JP]			2002-081223
Mar 25, 2002 [JP]			2002-084347
Jan 31, 2003 [JP]			2003-024649

Current U.S. Class: 438/106 ; 257/E21.001; 438/108; 438/125; 438/907

Current International Class: H01L 21/00 (20060101)

Field of Search: 438/106 257/E21.001

References Cited [Referenced By]

U.S. Patent Documents


3816215	June 1974	Wethington
4483810	November 1984	Bunk et al.
4493939	January 1985	Blaske et al.
6051093	April 2000	Tsukahara
6323454	November 2001	Mitsuhashi
7129446	October 2006	Imaoka
2004/0004295	January 2004	Stromberg et al.

Foreign Patent Documents


58-217475	Dec., 1983	JP
06-045405	Feb., 1994	JP
06-063733	Mar., 1994	JP
06-163646	Jun., 1994	JP
06-310849	Nov., 1994	JP
10-135278	May., 1998	JP
11-163025	Jun., 1999	JP
2000-246693	Sep., 2000	JP
2000-332063	Nov., 2000	JP
2001-351951	Dec., 2001	JP
2002-026509	Jan., 2002	JP
2002-043370	Feb., 2002	JP

Other References

Two communications from Japanese Patent Office re: related applications. cited by other .
Communication from Korean Patent Office re: countepart application. cited by other.

Primary Examiner: Geyer; Scott B.
Assistant Examiner: Roman; Angel
Attorney, Agent or Firm: Harness, Dickey & Pierce, P.L.C.

Parent Case Text

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No. 10/394,478 filed Mar. 21, 2003, now U.S. Pat. No. 7,017,636 claiming priority to JP2002-081220 filed Mar. 22, 2002, JP2002-081221 filed Mar. 22, 2002, JP2002-081222 filed Mar. 22, 2002, JP2002-081223 filed Mar. 22, 2002, JP2002-084347 filed Mar. 25, 2002, and JP2003-024649 filed Jan. 31, 2003. The disclosures of the above applications are incorporated herein by reference.

Claims

What is claimed is:

1. A method for manufacturing an electronic device, the method comprising: applying a conductive material to a plurality of electronic component mounting areas of a continuous body while transporting the continuous body with a transporting means; mounting a plurality of electronic components on the plurality of electronic component mounting areas where the conductive material is applied while transporting the continuous body with the transporting means; and performing a reflow treatment on the continuous body after the mounting of the plurality of electronic components in order to fix the plurality of electronic components on the continuous body via the conductive material, the performing the reflow treatment being executed while transporting the continuous body with the transporting means.

2. The method for manufacturing an electronic device according to claim 1, further comprising: after the performing the reflow treatment, performing a circuit block cutting treatment on the continuous body while transporting the continuous body with the transporting means.

3. The method for manufacturing an electronic device according to claim 1, the performing the reflow treatment including raising a temperature of an area to be heated of the continuous body by at least one of approaching and contacting at least part of the area to be heated with a heat generating device.

4. The method for manufacturing an electronic device according to claim 3, the performing the reflow treatment further including simultaneously contacting a plurality of circuit blocks with the heat generating device.

5. The method for manufacturing an electronic device according to claim 3, the performing the reflow treatment further including repeatedly contacting one of a plurality of circuit blocks with the heat generating device.

6. The method for manufacturing an electronic device according to claim 3, the performing the reflow treatment further including: transporting a first area to be heated of said continuous body to said heat generating device; raising a temperature of said first area to be heated by contacting said first area to be heated with said heat generating device; transporting a second area to be heated of said continuous body to said heat generating device; and raising a temperature of said second area to be heated by contacting said second area to be heated with said heat generating device.

7. The method for manufacturing an electronic device according to claim 3, the performing the reflow treatment further including retracting the heat generating device from the area to be heated, the retracting occurring at least one of during and after the raising said temperature of the area to be heated with the heat generating device.

8. The method for manufacturing an electronic device according to claim 3, the performing the reflow treatment further including: adjusting a length of the heat generating device such that the length of the heat generating device corresponds to a product pitch on the continuous body.

9. The method for manufacturing an electronic device according to claim 8, the performing the reflow treatment further including: sliding a supporting stand supporting the heat generating device along a transport direction of the continuous body such that a position of the heat generating device corresponds to the product pitch.

10. The method for manufacturing an electronic device according to claim 1, the performing the reflow treatment further including: transporting a first area to be heated of the continuous body to a first heat generating device and a second area to be heated of the continuous body to a second heat generating device, a temperature of the second heat generating device being higher than a temperature of the first heat generating device; and raising a temperature of the first area to be heated by contacting the first area to be heated with the first heat generating device, and raising a temperature of the second area to be heated higher than the first area to be heated by contacting the second area to be heated with the second heat generating device.

11. The method for manufacturing an electronic device according to claim 10, the first and second heat generating devices being arranged in parallel along the transport direction of the continuous body such that the first heat generating device is upstream of the second heat generating device.

12. The method for manufacturing an electronic device according to claim 10, the performing the reflow treatment further including: retracting the second heat generating device from the second area to be heated, the retracting occurring at least one of during and after the first and second areas to be heated are heated by the first and second heat generating devices.

13. The method for manufacturing an electronic device according to claim 12, the performing the reflow treatment further including: re-contacting the second heat generating device with the second area to be heated after the retracting.

14. The method for manufacturing an electronic device according to claim 13, the performing the reflow treatment further including: blowing hot air toward the second area to be heated before re-contacting the second heat generating device with the second area to be heated.

15. The method for manufacturing an electronic device according to claim 1, further comprising: before applying the conductive material, unwiring a continuous body with an unwiring means and transporting the continuous body with a transporting means.

16. The method for manufacturing an electronic device according to claim 1, further comprising: after the performing of the reflow treatment, taking up the continuous body with a take-up means.

17. The method for manufacturing an electronic device according to claim 1, further comprising: after the performing of the reflow treatment, performing a resin sealing treatment on the continuous body while transporting the continuous body with the transporting means.

18. The method for manufacturing an electronic device according to claim 1, the mounting the plurality of electronic components including mounting a first part of the plurality of electronic components on a first area of the plurality of electronic component mounting areas at a first mounting zone, and mounting a second part of the plurality of electronic components on a second area of the plurality of electronic component mounting areas at a second mounting zone after the mounting the first part of the plurality of electronic components.

19. A method for manufacturing an electronic device, the method comprising: applying a conductive material to a plurality of electronic component mounting areas of a continuous body while transporting the continuous body with a transporting means; mounting a plurality of electronic components on the plurality of electronic component mounting areas where the conductive material is applied while transporting the continuous body with the transporting means; and performing a reflow treatment on the continuous body after the mounting of the plurality of electronic components while transporting the continuous body with the transporting means; the performing the reflow treatment including: transporting an area to be heated of the continuous body to a heat generating device; and incrementally raising the temperature of the area to be heated by controlling a distance between the heat generating device and the area to be heated.

20. A method for manufacturing an electronic device, the method comprising: applying a conductive material to a plurality of electronic component mounting areas of a continuous body while transporting the continuous body with a transporting means; mounting a plurality of electronic components on the plurality of electronic component mounting areas where the conductive material is applied while transporting the continuous body with the transporting means; and performing a reflow treatment on the continuous body after the mounting of the plurality of electronic components while transporting the continuous body with the transporting means; the performing the reflow treatment including: raising a temperature of an area to be heated of the continuous body by at least one of approaching and contacting at least part of the area to be heated with a heat generating device; retracting the heat generating device from the area to be heated, the retracting occurring at least one of during and after of the raising the temperature of the area to be heated with the heat generating device; and inserting a heat shielding plate between the retracted heat generating device and the area to be heated.

21. A method for manufacturing an electronic device, the method comprising: applying a conductive material to a plurality of electronic component mounting areas of a continuous body while transporting the continuous body with a transporting means; mounting a plurality of electronic components on the plurality of electronic component mounting areas where the conductive material is applied while transporting the continuous body with the transporting means; and performing a reflow treatment on the continuous body after the mounting of the plurality of electronic components while transporting the continuous body with the transporting means; the performing the reflow treatment including: raising a temperature of an area to be heated of the continuous body by at least one of approaching and contacting at least part of the area to be heated with a heat generating device; retracting the heat generating device from the area to be heated, the retracting occurring at least one of during and after the raising of the temperature of the area to be heated with the heat generating device; and re-contacting the heat generating device with the area to be heated after the retracting.

22. The method for manufacturing an electronic device according to claim 21, the performing the reflow treatment further including blowing hot air toward the area to be heated before re-contacting the heat generating device with the area to be heated.

Description

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

The present invention relates to an apparatus, a method, and a program for manufacturing an electronic device, and more particularly to a soldering reflow process for a tape substrate, or the like on which electronic components are mounted.

2. Description of the Related Art

Generally, if semiconductor chips are mounted on a circuit substrate of a COF (Chip On Film) module, a TAB (Tape Automated Bonding) module, or the like in a conventional apparatus for manufacturing an electronic device, a method for performing a soldering/printing treatment, an electronic component mounting for performing a soldering/printing treatment, an electronic component mounting treatment, and a reflow treatment in a reel-to-reel method is used.

FIG. 23 illustrates a conventional method of manufacturing an electronic device. In FIG. 23, a solder applying zone 122 is arranged between a loader 121 and an unloader 123, and a mounting zone 132 between a loader 131 and an unloader 133, and a reflow zone 142 between a loader 141 and an unloader 143.

On a tape substrate 220 an electronic component mounting area is provided at each circuit block and a circuit substrate 221 is provided at each circuit block. A wiring 222 is formed on each circuit substrate 221, and an insulating film 223 is formed on the wiring 222 such that a terminal portion of the wiring 222 is exposed.

Furthermore, a tape substrate 220 where a predetermined block length of circuit substrates 221 are placed in a line, extends between an unwinding reel 121a and a take-up reel 123a. Additionally, the tape substrate 220 is transported to the solder applying zone 122 provided between the loader 121 and unloader 123, and a solder paste 224 is printed on the tape substrate 220 at the solder applying zone 122.

Next, when the solder paste 224 is printed to all the circuit substrates 221 which are placed in a line on the tape substrate 220, the tape substrate 220 where the solder paste 224 is printed is hung between the take-up reel 131a and unwinding reel 133a. Then, the tape substrate 220 is continuously transported to the mounting zone 132 provided between the loader 131 and unloader 133, and a semiconductor chip 225 is mounted on the tape substrate 220 at the mounting zone 132.

Next, when the semiconductor chips 225 are mounted to all the circuit substrates 221 placed in a line on the tape substrate 220, the tape substrate 220 where the semiconductor chips 225 is mounted is hung between an unwinding reel 141a and a take-up reel 143a. The semiconductor chips 225 are fixed on the circuit substrate 221 via the solder paste 224 by subsequently transporting the tape substrate 220 to the reflow zone 142 provided between the loader 141 and the unloader 143, performing a reflow treatment to the tape substrate 220 at the reflow zone 142. In addition, air heating by hot-air circulation, lamp heating, or far infrared ray heating methods is adopted at the reflow zone 142.

However, there have been problems in the apparatus for manufacturing an electronic device according to the prior art in that, as transport tacts are not uniform at the solder applying zone 122, mounting zone 132 and reflow zone 142, in order to perform the solder printing, and mounting and reflow of electronic components to one tape substrate 220, it is necessary to transport one tape substrate 220 three times between loaders 121, 131, 141 and unloaders 141, 142, 143, respectively, and the production efficiency is poor.

In other words, if the number of parts to be mounted on the circuit substrate 221 is great, the time required for mounting increases with almost no change in the time required for the solder applying and reflow treatment. Therefore, the transport tact gets longer at the mounting zone 132 than at the solder applying zone 122 and the reflow zone 142.

Moreover, in order to perform a solder applying treatment and a mounting treatment, it is necessary to stop the tape substrate 220 once it is transported to the solder applying zone 122 and mounting zone 132. In the reflow treatment using a reflow furnace, a successive transport process without halting the tape substrate 220 should be performed in the reflow furnace to prevent heating nonuniformity.

Therefore, in the conventional apparatus for manufacturing an electronic device, the transport tacts are different in the solder applying zone 122, mounting zone 132 and reflow zone 142, and the solder printing treatment, electronic component mounting treatment, and reflow treatment are separately performed.

Besides, according to the conventional mounting treatment, it is necessary to have the tape substrate 220 mounted with semiconductor chips 225 taken up by the take-up reel 131a before performing the reflow treatment. Thus, in order to prohibit the semiconductor chips 225 from falling off the tape substrate 220, the semiconductor chips 225 need tacking at the tape substrate 220 which further deteriorates production efficiency.

Thus, it is an object of the present invention to provide an apparatus for manufacturing an electronic device, a method of manufacturing an electronic device and an electronic manufacturing program that can reduce the number of transports of a tape substrate and improve production efficiency.

SUMMARY

In order to solve the aforementioned problems, an apparatus for manufacturing an electronic device according to an aspect of the present invention comprises: transport means for transporting a continuous body having circuit blocks, at each of which an electronic component mounting area is provided; mounting means for mounting an electronic component to the electronic component mounting area of the continuous body; and reflow means for performing a reflow treatment on the continuous body where electronic components are mounted, at the downstream side of the mounting position.

As a result, it is possible to perform the electronic component mounting treatment and reflow treatment at one time while the continuous body is retracted, so that it is possible to avoid the unnecessary process of re-winding the continuous body where the electronic components are mounted and performing the reflow treatment, reduce the number of transports of the tape substrate, eliminate the process of tacking the electronic components and improve the production efficiency.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a conductive material applying means for applying a conductive material to a predetermined area of the continuous body, at the upstream side of the mounting position.

Therefore, it is possible to perform the conductive material applying treatment, electronic component mounting treatment, and reflow treatment at one time by using the aforementioned conductive material applying means while the continuous body is retracted. As a result, it is possible to mount electronic components on the continuous body by unwinding the continuous body only once, thereby reducing the number of transports of the tape substrate and improving production efficiency.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the conductive material applying means applies a conductive material to a plurality of circuit blocks at one time.

Therefore, it is possible to mount electronic components to a plurality of circuit blocks all at once with one transport tact, reduce the number of stops of the tape substrate in performing the conductive material applying treatment, electronic component mounting treatment, and reflow treatment all at once and improve the production efficiency.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, a plurality of mounting means are provided for dividing and mounting a conductive material applied area applied by the conductive material applying means.

Therefore, it is possible to restrict the enlargement of a mounting unit and reduce a period of mounting time even when the number of parts mounted on respective circuit blocks is great. As a result, it is possible to match the time required for the mounting treatment with that of the conductive material applying treatment and reflow treatment, thereby reducing a period of stand-by time for the next process, even when the conductive material applying process, electronic component mounting process, and reflow process are performed continuously, and improve production efficiency.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises: an unwinding means for unwinding a continuous body transported by the transport means; and a take-up means for taking up the continuous body transported by the transport means.

Thus, it is possible to perform the conductive material applying process, conductive material mounting process, and reflow process all at once while the continuous body is transported between the unwinding and take-up means. As a result, it is possible to mount electronic components on the continuous body by transporting the continuous body between the unwinding and take-up means only once, thereby reducing the number of transports of the tape substrate and improving the production efficiency.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a cutting means provided in front of the take-up means for cutting the continuous body taken up by the take-up means at each circuit block.

Thus, it is possible to cut the continuous body where the electronic components are mounted at every circuit block without re-winding the continuous body. As a result, it is possible to mount electronic components and cut-out circuit blocks by unwinding the continuous body only once, thereby reducing the number of transports of the tape substrate and improving the production efficiency.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the conductive material applying means, the mounting means and the reflow means are arranged in parallel between the unwinding means and the take-up means along a transport direction of the continuous body.

As a result, it is possible to perform the conductive material applying treatment, electronic component mounting treatment, and reflow treatment in parallel to different areas of the continuous body retracted between the unwinding and take-up means thereby reducing a period of time required for mounting electronic components.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a buffer means provided in front of the reflow means for collecting the continuous body transported to the reflow means in the middle of the process.

Thus, it is possible to accumulate the tape substrate to which the conductive material applying treatment and electronic component mounting treatment are terminated in front part of the reflow means. As a result, even when trouble occurs in front of the reflow means in the conductive material applying process or electronic component mounting process, it is possible to perform the reflow treatment subsequently and efficiently.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a sealing resin applying means provided in front of the take-up means for applying sealing resin to a predetermined area of the reflowed continuous body; and a curing means for curing the sealing resin at the downstream side of the sealing resin applying position.

Thus, it is possible to perform the resin sealing treatment to the electronic components mounted on the continuous body without re-winding the continuous body where electronic components are mounted. As a result, it is possible to perform a series of treatments from electronic component mounting through resin sealing at one time by taking-up the continuous body only once, thereby reducing the number of transports of the tape substrate and improving production efficiency.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the reflow means comprises a heat generating means for raising the temperature of the area to be heated by controlling a distance between the area to be heated of the continuous body and the heat generating means.

Thus, it is possible to readily control the heating state of the area to be heated by controlling the distance between the area to be heated and heat generating means and the temperature of the area to be heated even when the area to be heated is stopped in the course of a transport process. As a result, it is possible to align the transport tact in the conductive material applying process or electronic component mounting process with that in the reflow process, thereby reducing damage to the electronic components or conductive material by restricting rapid changes in temperature during the reflow process, and performing the conductive material applying treatment, electronic component mounting treatment, and reflow treatment at one time while restricting the deterioration of product quality in the reflow treatment.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means raises the temperature of the area to be heated by approaching or contacting at least a part of the area to be heated of the continuous body.

Thus, it is possible to control the heating state of the area to be heated by radiated heat or conductive heat, precisely control the temperature profile by the unit of a circuit block and eliminate the need for an air shielding structure as in a hot-air circulating method or a light shielding structure as in a lamp heating or far infrared ray method.

As a result, it is possible to perform a reflow treatment by the unit of a circuit block, readily align the transport tact in the conductive material applying process or electronic component mounting process with that in the reflow process, restrict the enlargement of the reflow zone, and perform the conductive material applying treatment, electronic component mounting treatment, and reflow treatment at one time with spatial reduction.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means makes contact from the back side or the surface side (top or bottom) of the continuous body.

At this time, the heat generating means contacts the back side of the continuous body, so that it is possible to efficiently transfer heat to the continuous body and stably perform the reflow treatment even when electronic components having different heights are arranged on the continuous body.

In addition, since the heat generating means contacts the surface side of the continuous body, the heat generating means can directly contact the electronic components. Therefore, it is possible to prevent the heat generating means from contacting the continuous body and the continuous body from being adhered to the heat generating means.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means incrementally controls the temperature of the area to be heated step-by-step by controlling the speed or position of movement of the heat generating means relative to the continuous body.

Thus, it is possible to control the temperature of the area to be heated step-by-step without using a plurality of other heat generating means having different temperatures. As a result, it is possible to prevent a rapid change in temperature in performing the reflow treatment to the area to be heated, and restrict the deterioration of product quality in the reflow treatment with spatial reduction.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means is vertically or horizontally moveable.

At this time, even when the area to be heated is large, it is possible to raise or lower the temperature of the area to be heated step-by-step by making a vertical movement of the heat generating means while the temperature distribution is kept uniform in the area to be heated, and to retract the heat generating means rapidly from the area to be heated while an increase at the area at the reflow zone is restricted.

As a result, even when the transport system is stopped, it is possible to minimize spatial utilization, swiftly protect the area to be heated from thermal damage and restrict the deterioration of product quality in the reflow treatment.

The horizontal movement of the heat generating means makes it possible to match the transport speed of the continuous body with the moving speed of the heat generating means, thereby reducing a difference in the heating temperature caused by a static position of the area to be heated and maintaining the uniformity of heating time even in the case of a difference in product pitches.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means contacts an identical area to be heated a plurality of times.

Thus, it is possible to avoid thermal damage to the area to be heated. As a result, even when the heat generating means is retracted, it is possible to readily return the temperature of the area to be heated to its original level, while the temperature of the area to be heated is prevented from making a rapid change in temperature, thereby reducing the spatial utilization and restricting the deterioration of product quality in the reflow treatment.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means has a larger contact area than the conductive material applied area applied by the conductive material applying means, and raises the temperature of a plurality of circuit blocks at one time.

As a result, it is possible to perform the reflow treatment to a plurality of circuit blocks all at once by causing the area to be heated to make contact with the heat generating means and perform the reflow treatment without a change of the heat generating means even in the case of a difference in product pitches.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means includes a plurality of contact areas having different predetermined temperatures, and raises the temperature of the area to be heated step-by-step by sequentially causing the contact areas to make contact with the area to be heated.

As a result, it is possible to raise the temperature of the area to be heated step-by-step by causing the heat generating means to make contact with the area to be heated, control a temperature profile step-by-step by the unit of circuit blocks, and make unnecessary an air shielding structure as in a hot-air circulating method or a light shielding structure as in a lamp or far infrared ray heating method.

As a result, it is possible to perform the reflow treatment by the unit of the circuit blocks while a rapid change in temperature is prevented in performing the reflow treatment to the area to be heated, match a transport tact in the conductive material applying process or electronic component mounting process with that in the reflow process while the product deterioration is restricted in the reflow treatment, and perform the conductive material applying treatment, electronic component mounting treatment, and reflow treatment all at once without any deterioration of product quality.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the plurality of contact areas having different predetermined temperatures are arranged in parallel along the transport direction of the continuous body.

Thus, it is possible to make the areas to be heated in contact with the plurality of contact areas having different predetermined temperatures in sequence by transporting the continuous body, raise the temperature of the area to be heated step-by-step without making a movement of the heat generating means, and perform the reflow treatment to the plurality of areas to be heated all at once.

As a result, it is possible to efficiently perform the reflow treatment, while a rapid change is prevented in the temperature of the area to be heated in performing the reflow treatment, and perform the conductive material applying treatment, electronic component mounting treatment, and reflow treatment all at once while a restriction is made to any deterioration of product quality in the reflow treatment.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, a gap is provided between the contact areas having different predetermined temperatures.

Thus, it is possible to distinctively maintain the difference in temperature at the borders of contact areas having different predetermined temperatures and precisely control the temperature profile of each area to be heated, thereby improving the product quality in the reflow treatment.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, a plurality of contact areas having different predetermined temperatures can be moved individually.

Thus, it is possible to stop a main heat-up process to the other circuit blocks while a preliminary heat-up process to a specific circuit block is continuously made. As a result, it is possible to prevent the preliminary heat-up process from being stopped even when the main heat-up process is stopped in the middle and reduce the deterioration of product quality.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the heat generating means has a plurality of contact areas having different lengths corresponding to a plurality of product pitches and the contact areas are selected in correspondence with the product pitches.

Therefore, it is possible to make the heat generating means in contact with areas to be heated by a unit of circuit blocks even in case of different product pitches of the circuit blocks and improve the product quality in the reflow treatment by precisely controlling the temperature profile of respective circuit blocks.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a shutter means which is insertable and extractable between the area to be heated of the continuous body and the heat generating means.

Thus, it is possible to restrict the continuous heat-up of the area to be heated with radiant heat of the heat generating means when the area to be heated is removed from the heat generating means, and restrict thermal damage to the area to be heated even if the escape time from heating is prolonged.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a timer means for tracking the heating time of the area to be heated with the heat generating means, and retracting means for retracting the heat generating means from the area to be heated when the heating time exceeds a predetermined period of time.

Thus, it is possible to rapidly avoid thermal damage to the area to be heated even when a transport system is stopped due to trouble in the course of the heat-up treatment to the area to be heated, and restrict a deterioration of product quality in the reflow treatment.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a supporting stand for supporting the heat generating means; and a slide means for sliding the supporting stand along the transport direction of the continuous body.

Thus, it is possible to match the position of the heat generating means with a product pitch, while the position of the heat generating means is visually inspected, and maintain the uniformity of heating time even in case of different product pitches.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a auxiliary heating means for heating up the area to be heated of the continuous body from a direction different from that of the heat generating means.

Thus, it is possible to maintain the temperature of the area to be heated above a predetermined level of temperature, even when the area to be heated is removed from the heat generating means, and prevent defects of a product from being produced due to excessively lowering the temperature of the area to be heated.

The apparatus for manufacturing an electronic device according to one aspect of the present invention further comprises a temperature lowering means for lowering the temperature of the area to be heated, the temperature of which is raised by the heat generating means.

Thus, it is possible to rapidly lower the temperature of the area to be heated, the temperature of which is raised by the heat generating means, stabilize a bonding force by increasing the wettability of conductive material, and prevent the thermal oxidation of conductive material.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the temperature lowering means includes a flat plate member having a plurality of coolant blowout holes at a side facing the area to be heated.

Thus, it is possible to help a coolant evenly spread to every corner of the area to be heated, even when electronic components are mounted on the area to be heated, and efficiently lower the temperature of the area to be heated.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the temperature lowering means includes a covering and sandwiching opening having a U-shaped cross-section for covering and sandwiching the area to be heated from the vertical direction of its thickness (top and bottom), and a plurality of coolant blowout holes formed inside the covering and sandwiching opening.

Thus, it is possible to cool down the area to be heated from the surface side and back side of the area to be heated and efficiently lower the temperature of area to be heated.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the temperature lowering means includes a lower temperature area than the heat generating means, and lowers the temperature of the area to be heated by contacting the lower temperature area with at least one part of the area to be heated of the continuous body.

Thus, it is possible to control the cool state of the area to be heated by heat conduction and shorten a period of cool-off time by improving the cooling efficiency.

As a result, it becomes possible to readily match a transport tact of the heating process in the reflow process with that of the cooling process in the reflow process and perform the conductive material applying treatment, electronic component mounting treatment, and reflow treatment all at once while the thermal oxidation of the conductive material is restricted.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the lower temperature area has a larger contact area than the conductive material applied area applied by the conductive material applying means, and the temperature lowering means lowers the temperature of a plurality of circuit blocks at one time.

Thus, it is possible to perform cooling treatment to a plurality of circuit blocks all at once by causing the area to be heated to make contact with the lower temperature area of the temperature lowering means and perform cooling treatment without a change of the temperature lowering means, even in case of different product pitches and improve the production efficiency.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the lower temperature areas are arranged in parallel at the front part or rear part of the heat generating means or between the front and rear parts (or a pair) of the heat generating means.

Thus, it is possible to get the area to be heated in contact with the lower temperature area than the heat generating means by transporting the continuous body, lower the temperature of the area to be heated while the lower temperature area cooler than the heat generating means is fixed, and perform a cooling treatment to the plurality of the area to be heated all at once.

As a result, it is possible to perform the cooling treatment efficiently, restrict thermal oxidation of the conductive material, and perform the conductive material applying treatment, electronic component loading treatment, and reflow treatment all at once.

The lower temperature areas of the temperature lowering means are arranged in parallel at the front part of the heat generating means or between heat generating means for preventing the heat generated from the heat generating means from traveling to a portion of the temperature lowering means to which heat is not applied, maintaining the temperature profile of the area to be heated extremely precisely and improving the product quality in the reflow treatment.

In the apparatus for manufacturing an electronic device according to one aspect of the present invention, the lower temperature area includes a plurality of contact areas having different lengths corresponding to a plurality of product pitches, and the temperature lowering means selects the contact areas in correspondence with the product pitches.

As a result, it is possible to get the lower temperature area than the heat generating means in contact with the area to be heated in a circuit block unit, even when the circuit blocks have different product pitches, control the temperature profile of the each circuit block very precisely, and improve the product quality in the reflow treatment.

A method for manufacturing an electronic device according to one aspect of the present invention comprises a step of performing an electronic component mounting treatment, and a reflow treatment in parallel on a continuous body retracted between unwinding and take-up sides, the continuous body having circuit blocks, at each of which an electronic component mounting area is provided.

As a result, it is possible to simultaneously perform the electronic component mounting treatment and reflow treatment at other areas of the continuous body and perform the reflow treatment while the electronic component mounting treatment is carried out on the same continuous body. Thus, it also is possible to perform the electronic component mounting treatment and reflow treatment by transporting the continuous body between the unwinding and take-up sides only once, start the reflow treatment on the same continuous body without terminating the electronic component mounting treatment to all the circuit blocks of the continuous body and improve the production efficiency.

A method for manufacturing an electronic device according to one aspect of the present invention comprises a step of performing at least one of a conductive material applying treatment, a resin sealing treatment, and a circuit block cutting-out treatment in parallel, on the continuous body retracted between the unwinding side and the take-up side.

As a result, it is possible to perform a series of treatments from the electronic component mounting treatment through the resin sealing treatment or cutting-out treatment of the circuit block at one time, reduce the number of transports of the tape substrate and improve the production efficiency.

A method for manufacturing an electronic device according to one aspect of the present invention comprises the steps of moving an electronic component unmounted area of a continuous body to a mounting zone and moving to a reflow zone an electronic component mounting-finished area of the continuous body, to which an electronic component is mounted in the mounting zone, by transporting the continuous body having circuit blocks, at each of which an electronic component mounting area is provided; mounting an electronic component to the unmounted area of the continuous body in the mounting zone; and performing a reflow treatment on the electronic component mounting-finished area of the continuous body in the reflow zone.

Therefore, it is possible to perform an electronic component mounting treatment and a reflow treatment all at once, while the continuous body is retracted, reduce the stand-by time of the electronic component mounting treatment until the reflow treatment is made available to the same continuous body, and improve the production efficiency.

A method for manufacturing an electronic device according to one aspect of the present invention comprises the steps of moving a conductive material unapplied area of a continuous body to a conductive material applying zone, moving to a mounting zone a conductive material applying-finished area of the continuous body to which a conductive material is applied in the conductive material applying zone, and moving to a reflow zone an electronic component mounting-finished area of the continuous body at which an electronic component is mounted, by transporting the continuous body having circuit blocks, at each of which an electronic component mounting area is provided; applying a conductive material to the conductive material unapplied area of the continuous body in the conductive material applying zone; mounting an electronic component to the conductive material applying-finished area of the continuous body in the mounting zone; and performing a reflow treatment on the electronic component mounting-finished area of the continuous body in the reflow zone.

As a result, it is possible to perform the conductive material applying treatment, the electronic component mounting treatment and the reflow treatment at one time while the continuous body is retracted, reduce the stand-by time of the conductive material applying treatment until an electronic component mounting treatment is made available and that of the electronic component mounting treatment until a reflow treatment is made available, and improve the production efficiency.

In the a method for manufacturing an electronic device according to one aspect of the present invention, the reflow treatment raises the temperature of the area to be heated by making the heat generating means approach or contact at least one part of the area to be heated of the continuous body.

As a result, it is possible to control the heating state of the area to be heated with radiated heat or conductive heat and make a swift control of the temperature of the area to be heated.

Therefore, it is possible to readily avoid thermal damage to the area to be heated, perform the reflow treatment to the area to be heated, while the transport tact in the conductive material applying process matches with that in the electronic component mounting process, maintain the product quality good in the reflow treatment, and perform the conductive material applying treatment, electronic component mounting treatment, and reflow treatment at one time.

The method for manufacturing an electronic device according to one aspect of the present invention comprises a step of contacting a plurality of circuit blocks to the heat generating means at one time.

Thus, it is possible to perform the reflow treatment to the plurality of circuit blocks at one time by contacting the area to be heated to the heat generating means and improve the production efficiency.

The method for manufacturing an electronic device according to one aspect of the present invention comprises a step of contacting the same circuit block to the heat generating means a plurality of times.

Therefore, because thermal damage is avoided in the area to be heated, it is possible to readily return the area to be heated to its original state of temperature, and prevent a rapid change in temperature even in case of separate heat generating means, reduce space requirements (spatial utilization) and restrict the deterioration of product quality in the reflow treatment.

In the method for manufacturing an electronic device according to one aspect of the present invention, the reflow treatment includes the steps of transporting a first area to be heated of the continuous body to the heat generating means; raising the temperature of the first area to be heated by contacting the first area to be heated, which is transported to the heat generating means with the heat generating means; transporting a second area to be heated of the continuous body to the heat generating means; and raising the temperature of the second area to be heated by contacting the transported second area to be heated, which is transported to the heat generating means, with the heat generating means.

As a result, it is possible to contact the area to be heated to the heat generating means by transporting the continuous body to the heat generating means. Therefore, it is possible to improve the efficiency of the reflow treatment, perform the conductive material applying treatment and electronic component mounting treatment at one time and improve the production efficiency.

In the method for manufacturing an electronic, device according to one aspect of the present invention, the reflow treatment includes the steps of transporting the area to be heated of the continuous body to the heat generating means; and incrementally raising the temperature of the area to be heated step-by-step by making the heat generating means approach the area to be heated, which is transported to the heat generating means.

Thus, a heat generating means having a constant temperature is utilized to make it possible to raise the temperature of the area to be heated step-by-step, reduce the use of space and restrict thermal damage in performing the reflow treatment.

The method for manufacturing an electronic device according to one aspect of the present invention comprises a step of retracting the heat generating means from the area to be heated after or in the middle of the process of heating up the area to be heated with the heat generating means.

Therefore, it is possible to swiftly avoid thermal damage to the area to be heated, even when the transport system stops in the middle of the process of heating the area to be heated, and restrict the deterioration of product quality in the reflow treatment.

The method for manufacturing an electronic device according to one aspect of the present invention comprises a step of inserting a heat shielding plate between the retracted heat generating means and the area to be heated.

Therefore, it is possible to restrict thermal damage to the area to be heated by refracting the heat generating means from the area to be heated by a sufficient distance to insert a heat shielding plate between the heat generating means and the area to be heated, reduce the use of space, and restrict the deterioration of product quality in the reflow treatment.

The method for manufacturing an electronic device according to one aspect of the present invention comprises the step of re-contacting the heat generating means, which is retracted from the area to be heated, with the area to be heated.

Since the area to be heated is avoided from thermal damage, it is possible to readily return the area to be heated to its original temperature while the area to be heated is prevented from a rapid change in temperature even when the heat generating means is retracted.

The method for manufacturing an electronic device according to one aspect of the present invention comprises the step of blowing hot air toward (against) the area to be heated before re-contacting the heat generating means, which is retracted from the area to be heated, with the area to be heated.

Therefore, it is possible to maintain the area to be heated above a predetermined temperature even when the area to be heated is retracted from the heat generating means and prevent product defects.

In the method for manufacturing an electronic device according to one aspect of the present invention, the reflow treatment comprises the steps of respectively transporting the first area to be heated of the continuous body to the first heat generating means and the second area to be heated of the continuous body to the second heat generating means, the temperature of which is higher than that of the first one; and raising the temperature of the first area to be heated by contacting the first area to be heated, which is transported to the first heat generating means, with the first heat generating means and the temperature of the second area to be heated higher than the first area to be heated by contacting the second area to be heated, which is transported to the second heat generating means, with the second heat generating means.

Therefore, it is possible to raise the temperature of a plurality of areas to be heated step-by-step at one time by transporting the continuous body, restrict thermal damage in the reflow treatment, and improve swiftness of the reflow treatment.

As a result of the aforementioned process, it is possible to prevent transportation of a continuous body from being rate-limited in the reflow treatment, restrict the deterioration of product quality in the reflow treatment, maintain the product quality and improve production efficiency.

In the method for manufacturing an electronic device according to one aspect of the present invention, the first and second heat generating means are arranged in parallel along the transport direction of the continuous body such that the first heat generating means becomes a front part.

Thus, it is possible to contact a plurality of areas to be heated to the plurality of heat generating means having different predetermined temperatures at one time by transporting the continuous body and raising the temperature of the plurality of areas to be heated step-by-step at one time without movement of the heat generating means.

As a result, it is possible to efficiently perform the reflow treatment while the area to be heated is prevented from a rapid change in temperature in performing the reflow treatment and perform the conductive material applying treatment, electronic component mounting treatment and reflow treatment one time while the deterioration of product quality is restricted in the reflow treatment.

The method for manufacturing an electronic device according to one aspect of the present invention comprises the step of retracting the second heat generating means from the second area to be heated with the first heat generating means in contact with the first area to be heated after or while the areas to be heated are heated by the first and second heat generating means.

As a result, it is possible to swiftly avoid thermal damage to the second area to be heated while the first area to be heated is kept constant at a certain temperature, even when the transport system stops in the middle of the process of heating the plurality of areas to be heated, and restricts the deterioration of product quality in the reflow treatment, even in case of different heating states of the areas to be heated.

The method for manufacturing an electronic device according to one aspect of the present invention comprises the step of again contacting the second heat generating means, which is retracted from the second area to be heated, with the second area to be heated.

As a result, it is possible to return the second area to be heated to its original temperature without any influence on the temperature of the first area to be heated, even when the second heat generating means is retracted from the second area to be heated because thermal damage to the second area to be heated is avoided, and re-start the reflow treatment without any product defects.

The method for manufacturing an electronic device according to one aspect of the present invention comprises the step of blowing hot air against the second area to be heated before again contacting the second heat generating means, which is retracted from the second area to be heated, with the second area to be heated.

Therefore, it is possible to maintain the second areas to be heated above a predetermined level of temperature even when the second area to be heated is retracted from the second heat gener