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Atomic layer deposited Zr-Sn-Ti-O films using TiI.sub.4 Number:7,410,917 from the United States Patent and Trademark Office (PTO) owispatent

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Title: Atomic layer deposited Zr-Sn-Ti-O films using TiI.sub.4

Abstract: Various structures having a dielectric film containing Zr--Sn--Ti--O formed by atomic layer deposition using a TiI.sub.4 precursor and a method of fabricating structures having such a dielectric film produce the structures with a reliable dielectric layer having an equivalent oxide thickness thinner than attainable using SiO.sub.2. Dielectric films containing Zr--Sn--Ti--O formed by atomic layer deposition using TiI.sub.4 are thermodynamically stable such that the Zr--Sn--Ti--O will have minimal reactions with a silicon substrate or other structures during processing.

Patent Number: 7,410,917 Issued on 08/12/2008 to Ahn,   et al.

Inventors: Ahn; Kie Y. (Chappaqua, NY), Forbes; Leonard (Corvallis, OR)
Assignee: Micron Technology, Inc. (Boise, ID)
Appl. No.: 11/214,693
Filed: August 29, 2005

Related U.S. Patent Documents
Application NumberFiling DatePatent NumberIssue Date
10309583Dec., 20026958302

Current U.S. Class: 438/785 ; 257/E21.129; 427/124
Current International Class: H01L 21/31 (20060101)
Field of Search: 438/785 427/124 257/E21.129

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