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Ball grid array package with patterned stiffener layer Number:6,906,414 from the United States Patent and Trademark Office (PTO) owispatent

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Title: Ball grid array package with patterned stiffener layer

Abstract: Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. An IC die is mounted in a centrally located cavity of a substantially planar first surface of a stiffener. The first surface of a substrate is attached to a substantially planar second surface of the stiffener. The second surface of the stiffener is opposed to the first surface of the stiffener. A centrally located protruding portion on the second surface of the stiffener is opposed to the centrally located cavity. The protruding portion extends through an opening in the substrate. A wire bond is coupled from a bond pad of the IC die to a contact pad on the first surface of the substrate through a through-pattern in the stiffener. The through-pattern in the stiffener is one of an opening through the stiffener, a recessed portion in an edge of the stiffener, a notch in an edge of the recessed portion, and a notch in an edge of the opening.

Patent Number: 6,906,414 Issued on 06/14/2005 to Zhao,   et al.

Inventors: Zhao; Sam Ziqun (Irvine, CA); Khan; Reza-ur Rahman (Rancho Santa Margarita, CA)
Assignee: Broadcom Corporation (Irvine, CA)
Appl. No.: 284340
Filed: October 31, 2002

Current U.S. Class: 257/707; 257/706; 257/711; 257/712; 257/713; 257/737; 257/738; 257/780; 257/784; 257/787; 257/E23.092; 257/E23.106
Intern'l Class: H01L 023/10; H01L023/34; H01L023/48; H01L023/52
Field of Search: 257/707,706,711,712,713,780,784,787,738,737

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Primary Examiner: Parekh; Nitin
Attorney, Agent or Firm: Sterne, Kessler, Goldstein & Fox, PLLC
Parent Case Text


CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No. 60/352,877, filed Feb. 1, 2002, which is herein incorporated by reference in its entirety, and is a continuation-in-part of pending U.S. application "Enhanced Die-up Ball Grid Array Packages and Method for Making the Same," Ser. No. 09/984,259, filed Oct. 29, 2001, which is a continuation-in-part of pending U.S. application "Enhanced Die-Up Ball Grid Array and Method for Making the Same," Ser. No. 09/742,366, filed Dec. 22, 2000, which are incorporated herein by reference in their entirety.

The following applications of common assignee are related to the present application, have the same filing date as the present application, and are herein incorporated by reference in their entireties:

"Ball Grid Array Package Enhanced With a Thermal And Electrical Connector," Ser. No. 10/284,312;

"Ball Grid Array Package with Stepped Stiffener Layer," Ser. No. 10/284,371;

"Ball Grid Array Package Fabrication with IC Die Support Structures," Ser. No. 10/284,349;

"Ball Grid Array Package with Multiple Interposers," Ser. No. 10/284,166; and

"Ball Grid Array Package with Separated Stiffener Layer," Ser. No. 10/284,366.
Claims


1. A stiffener for stiffening a substrate in a ball grid array (BGA) package, comprising:

a substantially planar first surface having a centrally located cavity;

a substantially planar second surface opposed to said first surface, wherein said second surface has a centrally located protruding portion that opposes said centrally located cavity; and

at least one recessed portion in at least one edge of said first and said second surfaces, wherein said at least one edge has a first corner at a first end and a second corner at a second end, wherein said at least one recessed portion is located between said first and second corners of said at least one edge wherein the second surface is capable of attachment to the substrate such that said protruding portion extends through a centrally located window opening that is open at first and second surfaces of the substrate, and

wherein said first surface of said stiffener in said cavity is capable of mounting an integrated circuit die.

2. The stiffener of claim 1, wherein said cavity is substantially rectangular shaped, having a first edge, a second edge, a third edge, and a fourth edge.

3. The stiffener of claim 2, wherein at least one recessed portion includes:

a first substantially rectangular shaped recessed portion in a first edge of said first and said second surfaces;

a second substantially rectangular shaped recessed portion in a second edge of said first and said second surfaces;

a third substantially rectangular shaped recessed portion in a third edge of said first and said second surfaces; and

a fourth substantially rectangular shaped recessed portion in a fourth edge o


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