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Conductive pad design modification for better wafer-pad contact Number:7,520,968 from the United States Patent and Trademark Office (PTO) owispatent

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Title: Conductive pad design modification for better wafer-pad contact

Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.

Patent Number: 7,520,968 Issued on 04/21/2009 to Mavliev,   et al.

Inventors: Mavliev; Rashid A. (Campbell, CA), Karuppiah; Lakshmanan (San Jose, CA)
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Appl. No.: 11/243,488
Filed: October 4, 2005

Related U.S. Patent Documents
Application NumberFiling DatePatent NumberIssue Date
60616028Oct., 2004

Current U.S. Class: 204/279 ; 204/224M; 204/224R; 205/653; 205/662; 205/663; 451/533; 451/534; 451/539
Current International Class: C25B 9/00 (20060101)
Field of Search: 204/279,224M,224R 451/533,534,539 205/653,662,663

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