Enhanced die-down ball grid array and method for making the same Number:7,402,906 from the United States Patent and Trademark Office (PTO) owispatent An apparatus, system, and method for assembling a ball grid array (BGA) package is described. A stiffener/heat spreader is provided. A substrate has a first surface and a second surface. The substrate has a central window-shaped aperture that extends through the substrate from the first substrate surface to the second substrate surface. The first substrate surface is attached to a surface of the stiffener/heat spreader. A portion of the stiffener/heat spreader is accessible through the central window-shaped aperture. An IC die has a first surface and a second surface. The first IC die surface is mounted to the accessible portion of the stiffener/heat spreader. A drop-in heat spreader has a surface that is mounted to the second IC die surface.<H Enhanced, making, Enhanced, die, do, 7402906.html, Patent, pto, 7402906

Title: Enhanced die-down ball grid array and method for making the same

Abstract: An apparatus, system, and method for assembling a ball grid array (BGA) package is described. A stiffener/heat spreader is provided. A substrate has a first surface and a second surface. The substrate has a central window-shaped aperture that extends through the substrate from the first substrate surface to the second substrate surface. The first substrate surface is attached to a surface of the stiffener/heat spreader. A portion of the stiffener/heat spreader is accessible through the central window-shaped aperture. An IC die has a first surface and a second surface. The first IC die surface is mounted to the accessible portion of the stiffener/heat spreader. A drop-in heat spreader has a surface that is mounted to the second IC die surface.

Patent Number: 7,402,906 Issued on 07/22/2008 to Rahman Khan, et al.

Inventors: Rahman Khan; Reza-ur (Rancho Santa Margarita, CA), Zhao; Sam Ziqun (Irvine, CA)
Assignee: Broadcom Corporation (Irvine, CA)

Appl. No.: 10/891,519

Filed: July 15, 2004

Related U.S. Patent Documents


Application Number	Filing Date	Patent Number	Issue Date
09783034	Feb., 2005	6853070

Current U.S. Class: 257/712 ; 257/701; 257/704; 257/713

Current International Class: H01L 23/24 (20060101)

Field of Search: 257/701,706,707,712,717,733,737 438/122,125,613

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Primary Examiner: And jar; Leonardo
Attorney, Agent or Firm: Sterne, Kessler, Goldstein & Fox PLLC

Parent Case Text

CROSS-REFERENCE TO OTHER APPLICATIONS

The following application of common assignee is related to the present application, and is herein incorporated by reference in its entirety:

"Enhanced Die-Up Ball Grid Array and Method for Making the Same," Ser. No. 09/742,366, filed Dec. 22, 2000.

Claims

What is claimed is:

1. A ball grid array (BGA) package, comprising: a first heat spreader; a substrate having an opening that extends through said substrate, wherein said substrate is attached to a surface of said first heat spreader; an IC die having opposing first and second surfaces, whe