Title: Floating chip photonic device and method of manufacture
Abstract: A solid state lamp includes a mounting area adapted to contain a light emitting diode (LED) chip and a suspension media which physically isolates the diode from the mounting area. The suspension media, while substantially optically transparent, includes suspended phosphor particles for down conversion and scattering of LED emissions. Additionally, the suspension media includes thermal conductivity additives to improve device thermal conductivity in higher power operations.
Patent Number: 6,867,542 Issued on 03/15/2005 to Sun, et al.
| Inventors:
|
Sun; Xiao-Dong (Schenectady, NY);
Minnear; William P. (Clifton Park, NY)
|
| Assignee:
|
General Electric Company (Schenectady, NY)
|
| Appl. No.:
|
537192 |
| Filed:
|
March 29, 2000 |
| Current U.S. Class: |
313/512; 313/498; 313/501; 313/502; 257/79; 257/81; 257/98; 257/99; 257/100; 362/237; 362/240; 362/241 |
| Intern'l Class: |
H01J 001//62; H01L 033//00 |
| Field of Search: |
313/500-512
257/98,99
362/800,293
|
References Cited [Referenced By]
U.S. Patent Documents
| 3676668 | Jul., 1972 | Collins et al.
| |
| 4114177 | Sep., 1978 | King | 257/81.
|
| 5167556 | Dec., 1992 | Stein | 445/24.
|
| 5198479 | Mar., 1993 | Shiobara et al. | 523/214.
|
| 5441918 | Aug., 1995 | Morisaki et al. | 438/118.
|
| 5618872 | Apr., 1997 | Pohl et al. | 524/430.
|
| 5777433 | Jul., 1998 | Lester et al. | 313/512.
|
| 5813753 | Sep., 1998 | Vriens et al. | 362/293.
|
| 5962971 | Oct., 1999 | Chen | 313/512.
|
| 6015719 | Jan., 2000 | Kish et al. | 438/29.
|
| 6121637 | Sep., 2000 | Isokawa et al. | 257/99.
|
| 6274890 | Aug., 2001 | Oshio et al. | 257/98.
|
| 6335548 | Jan., 2002 | Roberts et al. | 257/98.
|
| 6576930 | Jun., 2003 | Reeh et al. | 257/98.
|
| Foreign Patent Documents |
| 2001135768 | May., 2001 | JP | .
|
Primary Examiner: Williams; Joseph
Assistant Examiner: Roy; Sikha
Attorney, Agent or Firm: Fay, Sharpe, Fagan, Minnich & McKee, LLP
Claims
What is claimed is:
1. A solid state lamp comprising:
a light emitting element;
a mounting area adapted to contain the light emitting element; and,
a suspension media disposed between said mounting area and said light
emitting element which supportably surrounds the light emitting element
within the mounting area.
2. The solid state lamp as set forth in claim 1, wherein the suspension
media comprises a substantially optically transparent material.
3. The solid state lamp as set forth in claim 1, wherein the suspension
media includes a first layer disposed between the mounting area and the
light emitting element, the suspension media further comprising:
a second layer covering the light emitting element and the first layer.
4. The solid state lamp as set forth in claim 3, wherein selected ones of
the first layer and the second layer comprise a thermally conductive
filler.
5. The solid state lamp as set forth in claim 3, wherein selected ones of
the first layer and the second layer comprise phosphor.
6. The solid state lamp as set forth in claim 3, further comprising a third
layer disposed between the light emitting element and the second layer.
7. The solid state lamp as set forth in claim 4, wherein the thermally
conductive filler comprises at least one nano-particle selected from the
set of gold and silver.
8. The solid state lamp as set forth in claim 3, wherein at least one of
the first layer and the second layer comprises single crystal
nano-particles.
9. The solid state lamp as set forth in claim 3, wherein at least one of
the first layer and the second layer comprises dielectric nano-particles.
10. The solid state lamp of claim 1, wherein said mounting area comprises a
metal cup.
11. A photonic device comprising:
a mounting area;
a spacing element which spaces a semiconductor device from the mounting
area;
means for affixing the semiconductor device substantially within the
mounting area which affixing means comprises of an optically transparent
media disposed over the semiconductor device and the spacing element, the
spacing element and the affixing means surroundingly support the
semiconductor device in a suspended state within the mounting area;
wherein the spacing element includes an optically transparent media
disposed between the mounting area and the semiconductor device.
12. The photonic device as set forth in claim 11, wherein the optically
transparent media disposed between the mounting area and the semiconductor
device comprises silicone epoxy blended with phosphor particles.
13. The photonic device as set forth in claim 11, wherein the optically
transparent media disposed between the mounting area and the semiconductor
device comprises silicone epoxy blended with thermally conductive fillers.
14. The photonic device as set forth in claim 11 further comprising a
phosphor layer disposed over the semiconductor device between the spacing
element and the means for affixing the semiconductor device.
15. The photonic device of claim 11 wherein said mounting area comprises a
metal cup.
Description
BACKGROUND OF THE INVENTION
The present invention relates to the art of solid state lamp assemblies. It
finds particular application in conjunction with Light Emitting Diodes
(LED's), and will be described with particular reference thereto. It is to
be appreciated, however, that the present invention is also amenable to
other types of light emitting semiconductor devices.
Solid state lamp assemblies such as LEDs are typically made from a flat
chip of material, such as III-V nitrides gallium arsenide, and/or
phosphides and silicon carbide, suitably doped with material or designed
so as to form a p-n junction which emits light when current is passed
therethrough. Indeed, such devices emit light from all exposed surfaces
when injected with an appropriate input current. Undesirably however, the
light emitted by these devices tends to be of relatively low intensity due
to scattering and/or absorption.
This inefficiency has been recognized, and effort has been directed towards
solving this particular problem. Typical solutions tend to focus the light
emanating from the exposed chip surfaces. Exemplary methods of
implementation include angling the chip mounting area, frequently a cup,
to redirect emitted light, lining the mounting area with a reflective
surface, shaping the diode material itself into a lens, or adding a
separate lens fixture to the LED.
The present invention contemplates a new and improved method and apparatus
which helps to reduce certain of the above-referenced problems and others.
BRIEF SUMMARY OF THE INVENTION
In accordance with one aspect of the present invention, a solid state lamp
includes a light emitting element and a mounting area adapted to contain
the element. A suspension media supportably surrounds the element within
the mounting area.
In accordance with another aspect of the present invention, the suspension
media comprises a substantially transparent material.
In accordance with another aspect of the present invention, the suspension
media includes a first layer disposed between the mounting area and the
light emitting diode element, and a second layer covering the light
emitting diode element and the first layer.
In accordance with another aspect of the present invention, the first layer
includes a thermally conductive filler.
In accordance with another aspect of the present invention, the first layer
includes phosphor particles.
In accordance with another aspect of the present invention, the second
layer includes phosphor particles.
In accordance with another aspect of the present invention, a third layer
is supplied and located between the light emitting diode element and the
second layer.
In accordance with another aspect of the present invention, at least one of
the first or second layers includes gold or silver nano-particles.
In accordance with another aspect of the present invention, at least one of
the first or second layers includes single crystal nano-particles such as
diamonds.
In accordance with another aspect of the present invention, at least one of
the first or second layers includes dielectric nano-particles such as
fumed alumina, TiO.sub.2, SrTiO.sub.3, etc., to improve thermal
conductivity while minimizing optic scattering.
In accordance with another embodiment of the present invention, a method of
manufacturing a solid state lamp includes locating a suspension media in a
mounting area where a volume of the mounting area exceeds a volume of the
suspension media. The method further includes disposing a light emitting
device on the suspension media.
In accordance with another aspect of the present invention, the method
further includes affixing electrical leads to the light emitting device.
In accordance with another aspect of the present invention, the method
further includes depositing a phosphor embedded suspension layer over the
light emitting device and the suspension media.
In accordance with another embodiment of the present invention, a photonic
device includes a mounting area and a spacing element which both spaces a
semiconductor device from the mounting area and affixes the semiconductor
device within the mounting area.
In accordance with another aspect of the present invention, the spacing
element comprises an optically transparent media disposed between the
mounting area and the semiconductor device.
In accordance with another aspect of the present invention, the optically
transparent media includes silicone epoxy blended with phosphor particles.
In accordance with another aspect of the present invention, the optically
transparent media includes silicone epoxy blended with thermally
conductive fillers.
In accordance with another aspect of the present invention, the spacing
element includes an optically transparent media disposed over both the
semiconductor device and the spacing element.
In accordance with another aspect of the present invention, the photonic
device further includes a phosphor layer disposed over the semiconductor
device between the spacing element and the means for affixing.
One advantage of the present invention resides in an optic buffer or spacer
blended with thermally conductive fillers to improve thermal conductivity
and the refractive index of the device.
Another advantage of the present invention resides in the ability to blend
phosphor particles within the suspension media for down conversion and
scattering of LED emissions.
Yet another advantage of the present invention resides in the surrounding
of the LED chip by the suspension media providing a channel for the light
output from all surfaces of the chip.
Still further advantages and benefits of the invention will become apparent
to those of ordinary skill in the art upon reading and understanding the
following detailed description of the preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention may take form in various components and arrangements of
components, and in various steps and arrangements of steps. The drawings
are only for purposes of illustrating the preferred embodiments and are
not to be construed as limiting the invention.
FIG. 1 is a cross section of an LED photonic device in accordance with the
present invention;
FIG. 2 is a cross section of an LED photonic device according to an
alternate embodiment of the present invention; and,
FIG. 3 is a cross section of an LED photonic device according to an
alternate embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
With reference to FIG. 1, a photonic device 10 such as the LED illustrated
includes a metal mount 12 defining a mounting area or cup 14. A first
layer of suspension media 16, such as silicone epoxy, is deposited into
the cup 14. Those skilled in the art will appreciate that the silicone
epoxy 16 can be pure or filled with additives to improve thermal
conductivity, to adjust the refractive index, and/or to down convert the
emission from an LED and scatter light. The viscosity of the silicone
epoxy 16 is adjusted, for example by fillers or mild curing, to an extent
that a deposited LED chip will stick to and sit upon the first layer 16
without settling appreciably. At this point, an LED chip 20 is placed upon
the first layer 16. Either an upper face (with an electrode pad), or a
bottom face (sapphire) of the LED chip 20 is usable in this configuration
as a mounting face. Those skilled in the art will appreciate that if
electrical leads were not previously applied to the LED chip 20, such
wiring can now be bonded to the chip and to the electrode legs (not
shown).
A second layer of silicone epoxy 22 is deposited over the exposed face of
the LED chip 20 and the cured first layer 16. In the illustrated
embodiment, the second layer 22 includes suspended phosphor particles
blended into the silicon epoxy to improve down-conversion and scattering
of LED emissions. A conventional curing process, such as thermal/UV
curing, is then performed on the silicone phosphor blend. Those skilled in
the art will appreciate that conventional epoxy packaging such as forming
a dome shaped epoxy onto the mounted LED, can now occur as desired.
With reference now to FIG. 2, a floating chip LED 30 includes a metal mount
12 defining an LED mounting area or cup 14. A first layer of silicone
epoxy suspension media 32 is blended with thermally conductive fillers 34
(enlarged for illustration) to improve thermal conductivity for higher
power LED operations. In one embodiment, thermal conductivity filler 34
includes blended gold (Au) or silver (Ag) nano-particles which are
commercially available. The concentration of gold/silver nano-particles is
controlled to enhance the thermal conductivity without shorting the LED
circuit. This blend enhances thermal conductivity while not inducing
optical scattering due to the nanometer size of the particles 34. In
another embodiment, the thermal conductivity filler 34 can include single
crystal or dielectric nano-particles. Exemplary single crystal particles
include diamonds, while dielectric particles include various oxides such
as fumed alumina, TiO.sub.2, SrTiO.sub.3, etc. These nano-particles are
also commercially available. These particles contribute to improved
thermal conductivity while not inducing optical scattering. The resulting
composite layer is still an electric insulator, but the addition of high
dielectric constant additives improves the light extraction from the LED
by increasing the refractive index of the silicone composite layer 32.
The device 30 also includes an LED chip 20 placed on the first layer 32. As
above, wire bonding can alternately occur prior to placement, or after the
first layer 32 has been sufficiently cured. In the illustrated embodiment,
a phosphor layer 38 is deposited directly on the upper surface of the LED
20 and over the first layer 32. Those skilled in the art will recognize
that the phosphor layer 38 acts to down convert the light emitted from the
LED. A second suspension layer 40, substantially identical to the first
suspension layer 32, is provided over the phosphor layer 38 to hold the
LED chip 20 in place, and improve thermal conductivity by the addition of
thermal conductivity fillers 34.
With reference now to FIG. 3, an alternate embodiment is illustrated which
also increases the surface area from which an LED chip 20' emits light.
Substantially as above, a first layer 16 is deposited into an LED cup or
lead frame 14. The first layer 16 is then at least partially cured so that
it will support the LED chip 20' within the cup 14. While the chip 20' is
illustrated as being fully suspended within the cup 14, those skilled in
the art will appreciate that the chip 20' can alternately rest on the base
of the cup while still providing enhanced efficiency of emitted light. A
second layer 22 is then deposited over both the LED chip 20' and the first
layer 16 to further support the chip 20' and electrical leads 50. As
above, the suspension media 16, 22 may be dispersed with additives to
improve thermal efficiency and/or quality of output light.
The invention has been described with reference to the preferred
embodiments. Modifications and alterations will occur to others upon a
reading and understanding of the preceding detailed description. It is
intended that the invention be construed as including all such
modifications and alterations insofar as they come within the scope of the
appended claims or the equivalents thereof.
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