Title: Light energy processing device and method
Abstract: A machining apparatus includes a light source (1) for generating light energy, an optical system (2, 3) for guiding the generated light energy to a joint position of a workpiece, a table (5a) on which the workpiece is mounted, and a heating device (5b) provided at the table for heating the workpiece. The machining apparatus, a machining method and production equipment using the machining apparatus allow the workpiece to be locally heated fast, which is applicable to soldering or the like.
Patent Number: 6,998,572 Issued on 02/14/2006 to Endo, et al.
| Inventors:
|
Endo; Tadashi (Osaka, JP);
Sato; Masahiro (Hyogo, JP);
Fujii; Koji (Osaka, JP);
Nagayasu; Dokei (Hyogo, JP);
Watanabe; Mamoru (Hyogo, JP);
Goto; Yasuhiro (Hyogo, JP);
Ishino; Hisahide (Ishikawa, JP);
Kotani; Kenshi (Hyogo, JP);
Kuriaki; Hiroyuki (Osaka, JP);
Shimizu; Takashi (Osaka, JP)
|
| Assignee:
|
Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
|
| Appl. No.:
|
433999 |
| Filed:
|
September 27, 2002 |
| PCT Filed:
|
September 27, 2002
|
| PCT NO:
|
PCT/JP02/10122
|
| 371 Date:
|
June 10, 2003
|
| 102(e) Date:
|
June 10, 2003
|
| PCT PUB.NO.:
|
WO03/028932 |
| PCT PUB. Date:
|
April 10, 2003 |
Foreign Application Priority Data
| Sep 28, 2001[JP] | 2001-300656 |
| Current U.S. Class: |
219/121.85; 219/121.61; 219/121.63; 219/121.83 |
| Current Intern'l Class: |
B23K 1/00.5 (20060101); B23K 26/20 (20060101) |
| Field of Search: |
219/12185,121.63,121.64,121.62,121.82,121.83,851.2,851.3
228/101
|
References Cited [Referenced By]
U.S. Patent Documents
| 4327277 | Apr., 1982 | Daly.
| |
| 4792658 | Dec., 1988 | Langhans et al.
| |
| 4806728 | Feb., 1989 | Salzer et al.
| |
| 4995921 | Feb., 1991 | Davis et al.
| |
| 5153409 | Oct., 1992 | Rudaitis et al.
| |
| 5681490 | Oct., 1997 | Chang.
| |
| 6291794 | Sep., 2001 | Dulaney.
| |
| 2001/0019075 | Sep., 2001 | Abe et al.
| |
| Foreign Patent Documents |
| 2261620 | May., 1993 | GB.
| |
| 57-193277 | Nov., 1982 | JP.
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| 1-104493 | Apr., 1989 | JP.
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| 1-205869 | Aug., 1989 | JP.
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| 2-92452 | Apr., 1990 | JP.
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| 2-247076 | Oct., 1990 | JP.
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| 4-237589 | Aug., 1992 | JP.
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| 4-237589 | Aug., 1992 | JP.
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| 5-13503 | Jan., 1993 | JP.
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| 05-245624 | Sep., 1993 | JP.
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| 5-277716 | Oct., 1993 | JP.
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| 06-125169 | May., 1994 | JP.
| |
| 6-344127 | Dec., 1994 | JP.
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| 9-232747 | Sep., 1997 | JP.
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| 11-204933 | Jul., 1999 | JP.
| |
| 2001-47221 | Feb., 2001 | JP.
| |
| 2001-47221 | Feb., 2002 | JP.
| |
| 4-253565 | Sep., 2002 | JP.
| |
Other References
International Search Report for PCT Application No. PCT/JP02/10122 dated Dec.
23, 2002.
Form PCT/ISA/210 English translation.
|
Primary Examiner: Evans; Geoffrey S.
Attorney, Agent or Firm: RatnerPrestia
Claims
The invention claimed is:
1. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted;
a heating device provided at the table, for heating the workpiece;
a power supply for supplying electric power to the light source;
a first controller for controlling the power supply and the optical system;
a status recognizing unit for detecting a status of the workpiece;
a driver for moving the table; and
a second controller for controlling the driver, the second controller comprising
an interface for exchanging a signal with the first controller,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent, and
wherein the first controller controls at least one of the power supply and the
optical means based on the detected status.
2. The machining apparatus of claim 1,
wherein the optical system and the table have the light energy guided to the
joint position.
3. The machining apparatus of claim 1, further comprising:
an adjuster for changing an irradiation area of the light energy.
4. The machining apparatus of claim 1, wherein the optical system comprises:
a condenser; and
a galvano-mirror disposed closer to the joint position than the condenser.
5. The machining apparatus of claim 1, further comprising
a status recognizing unit for detecting a status of the workpiece,
wherein the first controller controls at least one of the power supply and the
optical means based on the detected status.
6. The machining apparatus of claim 1, further comprising
an aperture provided between the light source and the optical system, for blocking
at least a portion of the light energy.
7. The machining apparatus of claim 1, further comprising:
a heating-temperature-setting unit for setting a temperature of the heating device;
a heating-temperature display for displaying the temperature of the heating device; and
a temperature sensor for sensing the temperature of the heating device,
wherein the temperature of the heating device is held isothermally.
8. A machining apparatus
for machining a workpiece which includes a substrate, a component, and a joining
material for joining the component to the substrate, the joining material comprising
a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted;
a heating device provided at the table, for heating the workpiece,
a power supply for supplying electric power to the light source;
a first controller for controlling the power supply and the optical system; and
a periodic functioning checker for periodically checking functions of the optical
system and the power supply,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent.
9. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted; and
a heating device provided at the table, for heating the workpiece,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent, and
wherein the light source and the optical system joint the joint position with
a first level of the light energy, and then, apply a higher level of the light
energy than the first level to a cutting position of the workpiece.
10. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted; and
a heating device provided at the table, for heating the workpiece,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent, and
wherein the light source and the optical system joint the joint position with
a first level of the light energy, and then apply a higher level of the light energy
than the first level to a marking portion of the workpiece.
11. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted; and
a heating device provided at the table, for heating the workpiece,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent, and
wherein the light source and the optical system joint the joint position with
a first level of the light energy, and then apply a higher level of the light energy
than the first level to a surface reforming portion of the workpiece.
12. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted;
a heating device provided at the table, for heating the workpiece,
a workpiece-type input unit for inputting a type of the workpiece; and
a second heating device for heating the workpiece,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent, and
wherein the heating device and the second heating device are switched according
to the type of the workpiece.
13. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted;
a heating device provided at the table, for heating the workpiece,
a workpiece-fixing unit for fixing the workpiece to the heating device; and
a workpiece-positioning unit for positioning the workpiece at the heating device,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent.
14. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted;
a heating device provided at the table, for heating the workpiece; and
a float detector for detecting float of the workpiece from the table,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent.
15. A machining apparatus for machining a workpiece which includes a substrate,
a component, and a joining material for joining the component to the substrate,
the joining material comprising a solvent, said machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of the workpiece;
a table on which the workpiece is mounted;
a heating device provided at the table, for heating the workpiece, and
teaching-input selecting means for selecting a way of teaching the joint position,
wherein the heating device sets a temperature of the joining material to a temperature
lower than and close to a boiling point of the solvent.
16. A machining method comprising the steps of:
providing a workpiece which includes first and second components, and a joining
material for jointing the first component with the second component, the joining
material comprising a solvent;
positioning the workpiece at a predetermined position;
heating a portion of the positioned workpiece to set a temperature of the joining
material to a temperature lower than and close to a boiling point of the solvent; and
jointing the workpiece by applying light energy having a first level to a joint
position of the workpiece after said step of heating the portion,
wherein said step of heating the portion includes the sub-step of setting a temperature
of the portion to a temperature lower than a temperature increased by the applied
light energy.
17. The machining method of claim 16, further comprising the step of generating
a convection near the portion of the workpiece.
18. The machining method of claim 16, wherein said step of heating the portion
includes the sub-step of heating only the portion and an area near the portion.
19. The machining method of claim 16, wherein said step of heating the portion
includes the sub-step of heating the workpiece entirely.
20. The machining method of claim 16, wherein said step of heating the portion
includes the sub-step of blowing hot air to the portion.
21. The machining method of claim 16, wherein said step of jointing the workpiece
includes the sub-step of applying the light energy only to the joint portion and
a portion near the joint position.
22. The machining method of claim 16,
wherein the workpiece includes another joint position; and
wherein said step of jointing the workpiece includes the sub-step of applying
the light energy to the joint position and the another joint position simultaneously.
23. The machining method of claim 16,
wherein the workpiece includes another joint position; and
wherein said step of jointing the workpiece includes the sub-step of jointing
the joint position and the another joint position through changing a position where
the light energy is applied.
24. The machining method of claim 16, wherein said step of jointing the workpiece
includes the sub-step of applying the light energy to the joint position slantingly.
25. The machining method of claim 16, wherein said step of jointing the workpiece
includes the sub-steps of:
detecting a status of the joint position; and
controlling an amount of the applied light energy according to the detected status.
26. A machining method comprising the steps of:
providing a workpiece which includes first and second components, and a joining
material for jointing the first component with the second component, the joining
material comprising a solvent;
positioning the workpiece at a predetermined position;
heating a portion of the positioned workpiece to set a temperature of the joining
material to a temperature lower than and close to a boiling point of the solvent; and
jointing the workpiece by applying light energy having a first level to a joint
position of the workpiece after said step of heating the portion,
wherein said step of heating the portion includes the sub-step of applying light
energy having a second level to the portion, the second level being smaller than
the first level.
27. A machining comprising the steps of:
providing a workpiece which includes first and second components, and a joining
material for jointing the first component with the second component, the joining
material comprising a solvent;
positioning the workpiece at a predetermined position;
heating a portion of the positioned workpiece to set a temperature of the joining
material to a temperature lower than and close to a boiling point of the solvent; and
jointing the workpiece by applying light energy having a first level to a joint
position of the workpiece after said step of heating the portion,
wherein the workpiece includes another joint position; and
wherein said step of jointing the workpiece includes the sub-step of setting
a an amount of the light energy to be applied to the joint positions and the another
joint point.
28. A machining comprising the steps of:
providing a workpiece which includes first and second components, and a joining
material for jointing the first component with the second component, the joining
material comprising a solvent;
positioning the workpiece at a predetermined position;
heating a portion of the positioned workpiece to set a temperature of the joining
material to a temperature lower than and close to a boiling point of the solvent; and
jointing the workpiece by applying light energy having a first level to a joint
position of the workpiece after said step of heating the portion,
wherein said step of jointing the workpiece includes the sub-steps of:
increasing the light energy after a lapse of a first time from starting applying
the light energy; and
decreasing the light energy after a lapse of a second time from increasing the
light energy.
29. A machining method comprising the steps of:
providing a workpiece which includes first and second components, and a joining
material for jointing the first component with the second component, the joining
material comprising a solvent;
positioning the workpiece at a predetermined position;
heating a portion of the positioned workpiece to set a temperature of the joining
material to a temperature lower than and close to a boiling point of the solvent; and
jointing the workpiece by applying light energy having a first level to a joint
position of the workpiece after said step of heating the portion,
wherein the workpiece includes another joint position; and
wherein said step of jointing the workpiece includes the sub-step of repeating
to apply the light energy to the joint position and the another joint position
alternatively by time division.
30. Production equipment comprising a machining apparatus comprising:
a light source for generating a light energy;
an optical system for guiding said generated light energy to a joint position
of a workpiece which includes a substrate, a component, and a joining material
for joining the component to the substrate, the joining material comprising a solvent;
a table on which the workpiece is mounted;
a heating device provided at the table, for heating the workpiece;
a dispenser for applying the joining material to the joint position of the workpiece;
a mounter for mounting an object to a position where the joining material is
applied; and
a measuring unit for measuring a time elapsed from the applying of the joining
material by the dispenser to the applying the light energy by the machining apparatus,
wherein the heating device of the machining apparatus sets a temperature of the
joining material to a temperature lower than and close to a boiling point of the solvent,
wherein the machining apparatus applies the light energy to a joint position
of the object, and
wherein at least one of the light energy and the heating device is adjusted according
to an output of the measuring unit.
31. The production equipment of claim 30, further comprising:
an identifying unit for identifying a type of the workpiece;
a database for storing a machining condition corresponding to the type of the
workpiece; and
a processor for retrieving the machining condition from the database according
to the type identified,
wherein the machining apparatus captures the machining condition according to
a signal from the processor.
32. The production equipment of claim 30, further comprising
a reflow furnace for reflow-machining the workpiece and for sending the reflow-machined
workpiece to the machining apparatus.
33. The production equipment of claim 32, further comprising
an inspector for inspecting a joined state of a joint position of the reflow-machined workpiece,
wherein the machining apparatus joints another joint position of the workpiece
based on the joined state inspected by the inspector.
34. The production equipment of claim 30, further comprising
an inspector for inspecting a joined state of a joint position jointed by the
machining apparatus,
wherein the machining apparatus joints another joint position of the workpiece
according to the joined state inspected by the inspector.
35. The production equipment of claim 30, further comprising
a comparator for comparing the output from the measuring unit with a predetermined value,
wherein the at least one of the light energy and the heating device is adjusted
according to an output from the comparator.
36. The production equipment of claim 30, further comprising
an inspector for inspecting a joined state of the workpiece which is jointed
by the machining apparatus,
wherein the machining apparatus joints another joint position of the workpiece
according to the joined state inspected by the inspector.
Description
THIS APPLICATION IS A U.S. NATIONAL PHASE APPLICATION OF PCT INTERNATIONAL APPLICATION PCT/JP02/10122.
TECHNICAL FIELD
The present invention relates to a machining apparatus using heat energy, a machining
method, and production equipment using the machining apparatus.
BACKGROUND ART
A conventional machining apparatus includes a heating furnace (hereinafter referred
to as "reflow furnace") where a workpiece is placed to be heated at a required
temperature, and joints of the workpiece are, for example, soldered (hereinafter
referred to as "reflow"). Alternatively, the soldering is performed by heat energy
of a lamp light source or a laser beam source.
When workpieces including components having different heat resistances, different
shapes, or different colors are placed in the reflow furnace for reflow, the component
having low heat resistance burns and breaks or deforms. Such workpieces cannot
be placed in the reflow furnace for reflow.
The reflow furnace requires a time to be heated up to an initial predetermined
temperature, and if the workpiece requires a temperature change, it takes a time
for adjustment for the temperature change inefficiently. Moreover, the furnace
includes a heater requiring a large electricity, and the apparatus is large in
size, thus requiring a large floor space. Further, a workpiece including a film-like
or tape-like substrate cannot be cut by the reflow furnace, be marked, or be reformed
at its surface.
In the case that a component having a low heat resistance is soldered by a lamp
light source, a small heat energy requires a long time to set a temperature in
the furnace to a temperature for soldering, and thus may cause the workpiece to
melt or deform.
In the case that a component having a low heat resistance is soldered by a laser
beam source, a large heat energy in a short time easily produces a defective having,
for example, a solder ball or scattered solder.
It takes a time to move the light source, such as the lamp light source or the
laser beam source, to each joint of the workpiece with a servomotor, and thus a
high-speed soldering cannot be achieved.
SUMMARY OF THE INVENTION
A machining apparatus includes a light source for producing light energy, an
optical
system for guiding the produced light energy to a joint position of a workpiece,
a table on which the workpiece is mounted, and a heating device provided at the
table for heating the workpiece.
The machining apparatus, a machining method and production equipment using the
machining apparatus enables the workpiece to be heated fast and locally, thus being
applicable to soldering or the like.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic diagram of a machining apparatus in accordance with first
and second exemplary embodiments of the present invention.
FIG. 2 is a schematic diagram of a machining apparatus in accordance with a
third exemplary embodiment of the invention.
FIG. 3 is a schematic diagram of a machining apparatus in accordance with a
fourth exemplary embodiment of the invention.
FIG. 4 is a schematic diagram of a machining apparatus in accordance with a
fifth exemplary embodiment of the invention.
FIG. 5 is a schematic diagram of a machining apparatus in accordance with a
sixth exemplary embodiment of the invention.
FIG. 6 is a schematic diagram of a machining apparatus in accordance with a
seventh exemplary embodiment of the invention.
FIG. 7 is a schematic diagram of a machining apparatus in accordance with an
eighth exemplary embodiment of the invention.
FIG. 8 illustrates the layout of a heating device of a machining apparatus in
accordance with a ninth exemplary embodiment of the invention.
FIG. 9 illustrates positioning of a workpiece in a machining apparatus in accordance
with a tenth exemplary embodiment of the invention.
FIG. 10 is a flowchart for checking a function of a machining apparatus in accordance
with an eleventh exemplary embodiment of the invention.
FIG. 11 illustrates a teaching input selector of a machining apparatus in accordance
with a twelfth exemplary embodiment of the invention.
FIG. 12 is a schematic diagram of a machining apparatus in accordance with thirteenth
and fourteenth exemplary embodiments of the invention.
FIG. 13 is a flowchart of a machining method in accordance with the fourteenth embodiment.
FIG. 14 is a schematic diagram of a machining apparatus in accordance with a
fifteenth exemplary embodiment of the invention.
FIG. 15 is a flowchart of a machining method in accordance with the fifteenth embodiment.
FIG. 16 is an enlarged view of a local heating table in accordance with a sixteenth
exemplary embodiment of the invention.
FIG. 17 is an enlarged view of an overall heating device in accordance with
a seventeenth exemplary embodiment of this invention.
FIG. 18 is a schematic diagram of a machining apparatus in accordance with an
eighteenth exemplary embodiment of the invention.
FIG. 19 is a flow chart of a machining method in accordance with the eighteenth embodiment.
FIG. 20 is a schematic diagram of a machining apparatus in accordance with a
nineteenth exemplary embodiment of the invention.
FIG. 21 is a flow chart of a machining method in accordance with the nineteenth embodiment.
FIGS. 22A and 22B illustrate a machining method in accordance with a twentieth
exemplary embodiment of the invention.
FIG. 23 illustrates a machining method in accordance with a twenty-first exemplary
embodiment of the invention.
FIG. 24 is a flowchart of a machining method in accordance with a twenty-second
exemplary embodiment of the invention.
FIG. 25 shows a light radiation profile in accordance with a twenty-third exemplary
embodiment of the invention.
FIG. 26 is a schematic diagram of a machining apparatus in accordance with a
twenty-fourth exemplary embodiment of the invention.
FIG. 27 is a flowchart of a machining method in accordance with the twenty-fourth embodiment.
FIGS. 28A-28F illustrate light radiation profiles in accordance with a twenty-fifth
exemplary embodiment of the invention.
FIGS. 29A and 29B illustrate light radiation profiles in accordance with a
twenty-sixth exemplary embodiment of the invention.
FIG. 30 is a flowchart of a machining method in accordance with a twenty-seventh
exemplary embodiment of the invention.
FIG. 31 illustrates identifying of a workpiece in a machining apparatus in accordance
with a twenty-eighth exemplary embodiment of the invention.
FIG. 32 shows a relationship between a machining apparatus and reflow in accordance
with a twenty-ninth exemplary embodiment of the invention.
FIG. 33 illustrates identifying of a workpiece in a machining apparatus in accordance
with a thirtieth exemplary embodiment of the invention.
FIG. 34 shows a relationship between a machining apparatus and an inspector
in accordance with a thirty-first exemplary embodiment of the invention.
FIG. 35 illustrates a structure between a machining apparatus and a dispenser
in accordance with a thirty-second exemplary embodiment of the invention.
FIG. 36 illustrates a structure between a machining apparatus and a dispenser
in accordance with a thirty-third exemplary embodiment of the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(Exemplary Embodiment 1)
FIG. 1 is a schematic diagram of a machining apparatus in accordance with exemplary
embodiment 1. Workpiece
13 includes a printed board with solder cream, which
is joining material, applied thereto, and a surface-mounted component mounted on
the printed board. In order to solder the surface-mounted component to the printed
board, the machining apparatus includes light-energy power supply
101 and
laser diode device
1 for applying light energy to have the solder melt,
optical system
2 functioning as optical means for guiding the light energy
to a joint position by applying spotlight, galvano-mirror controller
4 and
galvano-mirror
3 for allowing the spotlight to scan a part to be melted
at a high speed, and table
5a on which workpiece
13 is mounted.
The machining apparatus further includes heating device
5b provided
at table
5a for preheating workpiece
13 for improving machining
quality and performance.
Workpiece
13 is mounted on table
5a and preheated
by heating device
5b. Next, galvano-mirror controller
4 and
galvano-mirror
3 allow the spotlight of the light energy, which is radiated
from light-energy power supply
101 and laser diode device
1 through
condenser
2, to scan the part of workpiece
13 that is to be melted
for irradiation.
This configuration reduces solvent contained in the solder, so that even short-time
radiation of light for joining does not cause the solvent to burst by expanding
during vaporization. For this reason, high-quality soldering can be executed without
scattering of a solder ball or the like. This high-speed local heating allows energy
saving and suppresses thermal damage to the surface-mounted electronic component.
XY(Z) table
6 functioning as means for moving an irradiation position
and provided at table
5a can move workpiece
13 in an XY(Z)
direction, thereby increasing a scanning area.
Further, an adjuster for changing an irradiation area of the light energy
applied to the joint position, such as a focal length adjusting unit, a fiber,
an irradiation angle or a mask (not shown), allows irradiation adapted to the shape
or use of the workpiece, such as irradiation with the light in the form of large/small
spot, a line, or a boarder of a square.
Light-energy power supply
101 may employ a laser-diode (LD) power
supply. Optical system
2 may employ a condenser. Heating device
5b
may employ a heating device. XY(Z) table
6 may be driven by a servomotor.
(Exemplary Embodiment 2)
In FIG. 1, controller
8 reads a machining condition corresponding to a
machining position of workpiece
13 from a machining condition storage unit
104 and provides the machining condition to light-energy power supply
101,
which in turn controls laser diode device
1 for generating a specified energy.
The light is condensed by optical system
2, is reflected by galvano-mirror
3 and is then applied to workpiece
13. Simultaneously, machining
position storage unit
105 supplies information about a heating position
to galvano-mirror controller
4, and thereby galvano-mirror
3 can
guide an incident light to the heating position. Heating device
5b preheats
workpiece
13 based on information from machining condition storage unit
104.
A personal computer, a sequencer or the like may be used for machining condition
storage unit
104 and machining position storage unit
105.
(Exemplary Embodiment 3)
In FIG. 2, controller
8 reads a machining condition corresponding to a
current machining position from machining condition storage unit
104 and
supplies the machining condition to light-energy power supply
101 in order
to machine workpiece
13. Simultaneously, camera
9 captures a machining
status, and thus, image recognition device
10 recognizes a machining result.
Comparator
102 compares the machining result recognized with information
about proper machining that is stored in machining status storage unit
103,
and then, machining condition storage unit
104 receives feedback from comparator
102. The machining condition is corrected based on the information fed back
and is supplied to light-energy power supply
101 for soldering or the like.
(Exemplary Embodiment 4)
FIG. 3 is a schematic diagram of a machining apparatus in accordance with exemplary
embodiment 4. Controller
8 reads a machining condition corresponding to
a machining position of workpiece
13 from machining condition storage unit
104 and supplies the machining condition to light-energy power supply
101,
which in turn controls laser diode device
1 for generating a specified energy.
The light is condensed by optical system
2, is reflected by galvano-mirror
3, and is then applied to workpiece
13. Simultaneously, machining
position storage unit
105 supplies information about a heating position
to galvano-mirror controller
4, and thereby, galvano-mirror
3 can
guide an incident light to the heating position of workpiece
13. Heating
device
5b can shorten machining time. If the machining position is
located out of a scanning range of galvano-mirror
3, controller
8
supplies positional information to table controller
106, and thereby table
driver
100 moves table
6 so that the machining position is located
within the scanning range of galvano-mirror
3.
(Exemplary Embodiment 5)
FIG. 4 is a schematic diagram of a machining apparatus in accordance with exemplary
embodiment 5. Controller
8 reads a machining condition corresponding to
a current machining position of workpiece
13 from machining condition storage
unit
104 and supplies the machining condition to light-energy power supply
101, which in turn controls laser diode device
1 for generating a
specified energy. The light is condensed by optical system
2, is reflected
by galvano-mirror
3, and is then applied to workpiece
13. Simultaneously,
machining position storage unit
105 supplies information about a heating
position to galvano-mirror controller
4, and thereby galvano-mirror
3
can guide an incident light to the heating position of workpiece
13. Heating
device
5b preheats workpiece
13 based on information from
machining condition storage unit
104.
Controller
8 further reads a cutting condition corresponding to
a cutting position on workpiece
13 from cutting condition storage unit
108
and supplies the cutting condition to light-energy power supply
101, which
in turn controls laser diode device
1 for generating a specified energy.
The light is condensed by optical system
2, is reflected by galvano-mirror
3, and is then applied to workpiece
13. Simultaneously, machining
position storage unit
105 supplies the information about the heating position
to galvano-mirror controller
4, and thereby, galvano-mirror
3 can
guide an incident light to the heating position. In this manner, film-like or tape-like
workpiece
13 is cut.
(Exemplary Embodiment 6)
FIG. 5 is a schematic diagram a machining apparatus in accordance with exemplary
embodiment 6. Controller
8 reads a machining condition corresponding to
a machining position of workpiece
13 from machining condition storage unit
104 and supplies the machining condition to light-energy power supply
101,
which in turn controls laser diode device
1 for generating a specified energy.
The light is condensed by optical system
2, is reflected by galvano-mirror
3, and is then applied to workpiece
13. Simultaneously, machining
position storage unit
105 supplies information about a heating position
to galvano-mirror controller
4, and thereby, galvano-mirror
3 can
guide an incident light to the heating position of workpiece
13. Heating
device
5b preheats workpiece
13 based on information from
machining condition storage unit
104.
Controller
8 further reads a marking condition corresponding to
the current machining position from marking condition storage unit
109 and
supplies the marking condition to light-energy power supply
101, which in
turn controls laser diode device
1 for generating a specified energy. The
light is condensed by optical system
2, is reflected by galvano-mirror
3,
and is then applied to workpiece
13. Simultaneously, machining position
storage unit
105 supplies the information about the heating position to
galvano-mirror controller
4, and thereby galvano-mirror
3 can guide
an incident light to the heating position. Workpiece
13 is thus marked by
the light energy. The marking may be a workpiece number, a machining result, a
manufacturing date or the like.
(Exemplary Embodiment 7)
FIG. 6 is a schematic diagram of a machining apparatus in accordance with exemplary
embodiment 7. Controller
8 reads a machining condition corresponding to
a machining position of workpiece
13 from machining condition storage unit
104 and supplies the machining condition to light-energy power supply
101,
which in turn controls laser diode device
1 for generating a specified energy.
The light is condensed by optical system
2, is reflected by galvano-mirror
3, and is then applied to workpiece
13. Simultaneously, machining
position storage unit
105 supplies information about a heating position
galvano-mirror controller
4, and thereby galvano-mirror
3 can guide
an incident light to the heating position of workpiece
13. Heating device
5b preheats the workpiece based on information from machining condition
storage unit
104.
Controller
8 reads a surface reforming condition corresponding
to the current machining position of the workpiece from surface reforming condition
storage unit
110 and supplies the surface reforming condition to light-energy
power supply
101, which in turn controls laser diode device
1 for
generating a specified energy. The light is condensed by optical system
2,
is reflected by galvano-mirror
3, and is then applied to workpiece
13.
Simultaneously, machining position storage unit
105 supplies the information
about the heating position to galvano-mirror controller
4, and thereby galvano-mirror
3 can guide an incident light to the surface reforming position of workpiece
13. In this manner, the surface of workpiece
13 is reformed.
(Exemplary Embodiment 8)
FIG. 7 is a schematic diagram of a machining apparatus in accordance with exemplary
embodiment 8. Controller
8 reads a machining condition corresponding to
a machining position of workpiece
13 from machining condition storage unit
104 and supplies the machining condition to light-energy power supply
101,
which in turn controls laser diode device
1 for generating a specified energy.
Aperture
111 permits only light having its unnecessary energy eliminated
to pass. The light condensed by optical system
2 is reflected by galvano-mirror
3 and is then applied to workpiece
13. Simultaneously, machining
position storage unit
105 supplies information about a heating position
to galvano-mirror controller
4, and thereby galvano-mirror
3 can
guide an incident light to the heating position of workpiece
13. Heating
device
5b preheats workpiece
13 based on information from
machining condition storage unit
104. In this manner, high-quality soldering
can be performed on workpiece
13.
(Exemplary Embodiment 9)
Referring to FIG. 8, exemplary embodiment 9 of this invention will be described.
In FIG. 8, heating temperature setting unit
203 sets a temperature for preheating
workpiece
13, thereby heating devices
5b-
1 and
5b-
2
are heated. Temperature sensors
202a and
202b detects
respective temperatures of heating devices
5b-
1 and
5b-
2.
When the temperature of heating devices
5b-
1 and
5b-
2
changes from the preheating temperature set, controller
8 receives feedback
to maintain the temperature of heating devices
5b-
1 and
5b-
2
at the set temperature. The temperatures of heating devices
5b-
1
and
5b-
2 may be displayed on heating temperature display
201.
The type of the workpiece is input to workpiece type input unit
200, and
heating devices
5b-
1 and
5b-
2 are switched
according to the type of the workpiece for soldering, thus allowing power saving.
Workpiece type input unit
200 may be implemented by a keyboard and
a touch panel, and heating temperature display
201 may be implemented by
the touch panel and a CRT.
(Exemplary Embodiment 10)
Exemplary embodiment 10 of the present invention will be described with
reference to FIG. 9. In FIG. 9, workpiece fixing units
204a and
204b
and workpiece positioning unit
205a and
205b are
mounted to heating device
5b or table
5a to fix and
position workpiece
13. Workpiece
13 may be fixed from behind by suction
by a vacuum suction pad (not shown).
Float detectors
206a and
206b determine whether
or not workpiece
13 is fixed and positioned properly without floating. Soldering
is performed after it is confirmed that workpiece
13 is properly fixed,
i.e., does not float. In this manner, high-quality machining can be performed for
workpiece
13.
(Exemplary Embodiment 11)
Exemplary embodiment 11 of the invention will be described with reference
to FIG. 10. In FIG. 10, periodic function checker
207 determines that the
number of inputs to the checker reach a predetermined number, and then automatically
checks respective functions of optical system
2, galvano-mirror
3,
galvano-mirror controller
4, light-energy power supply
101, laser
diode device
1. When the functions are not proper in comparison with a predetermined
range, the checker outputs an indication of abnormality. The predetermined range
is adjusted so that an operator receives a proper warning, and thus the apparatus
can be maintained early.
(Exemplary Embodiment 12)
Referring to FIG. 11, exemplary embodiment 12 of the preset invention will
be described. As shown in FIG. 11, data of a joint position of workpiece
13
is stored in controller
8 through a way selected from teaching-input selections
208a,
208b, and
208c.
Thus, a teaching input can be performed according to the type of workpiece
13 by the way selected by a user. Teaching-input selections
208a,
208b, and
208c may be implemented by an image recognition
device, such as a camera or a scanner, CAD data, and a CAD program.
(Exemplary Embodiment 13)
Referring to FIGS. 12 to 30, exemplary embodiment 10 of the invention will
be described. In a preheating performed by controlling heating device
5b
shown in FIG. 12, hygroscopic component of solder cream
159 is removed
as shown in FIGS. 22A and 22B, and a removal of an oxide film is facilitated by
melting flux. A preheating temperature is set lower than and close to a boiling
point of solvent included in the flux contained in solder cream
159, so
that the solvent can be vaporized and reduced in a short time.
Since the preheating lasts a short time, oxidation of solder component of the
solder during the preheating time is negligible. Thus, the solvent does not burst
by expanding during vaporization even when only a joint is heated quickly by light
energy. For this reason, high-quality soldering without scattering of a solder
ball or the like can be performed.
(Exemplary Embodiment 14)
Exemplary embodiment 14 of the invention will be described with reference
to FIGS. 12 and 13.
In FIG. 12, temperature sensor
5c detects a temperature of workpiece
13. Temperature sensor
5c may be implemented by a non-contact thermometer.
FIGS. 12 and 13 illustrate a machining apparatus and a flowchart of a machining
method in accordance with the present embodiment. First, workpiece
13 including
a substrate having solder cream applied thereto and a component mounted thereto
is placed on table
5a. Since heating device
5b heats
table
5a, workpiece
13 starts to be preheated soon after being
placed on the table.
Next, temperature sensor
5c determines whether or not the temperature
of workpiece
13 is equal to a temperature set lower than and close to a
boiling point of solvent included in flux contained in solder cream
159
and is lower than an increased temperature which will be achieved by light energy
for joining. If the detected temperature is out of an acceptable range, heating
device
5b is controlled so as to make the temperature of workpiece
13 be within the acceptable range.
After the detected temperature is determined to be in the acceptable range,
camera
9, image recognition device
10, and personal computer (PC)
8 identify a reference position. If the reference position cannot be identified,
an error is output to stop machining. If the reference position is identified,
it is determined whether or not the reference position is deviated from a given
taught position. If a deviation is detected, PC
8 corrects whole data of
irradiation positions according to the deviation.
According to the corrected data, XY(Z) table
6 moves workpiece
13
to a first irradiation position. After irradiation of a predetermined light energy
for a predetermined time, workpiece
13 is moved to a second irradiation
position. The moving of workpiece
13 and the irradiation with the light
energy are thus repeated until an N-th irradiation position (where N is the total
number of irradiation positions) is reached. Machining of workpiece
13 terminates
when as irradiation in the N-th position is completed.
The preheating performed by heating device
5b removes hygroscopic
component from solder cream
159 and facilitates removal of an oxide film
caused by melting the flux. A preheating temperature is set lower than and close
to the boiling point of solvent included in the flux contained in solder cream
159, so that the solvent can be vaporized and reduced in a short time.
Since the preheating lasts for a short time, oxidation of solder component
of the solder during the preheating time is negligible. Thus, the solvent does
not burst by expanding during vaporization even when only a joint is heated quickly
by the light energy. For this reason, high-quality soldering without scattering
of a solder ball can be performed.
It is noted that temperature sensor
5c is not necessarily required.
Even if the temperature is not detected, the similar machining can be performed
by control of a setting temperature of heating device
5b and the
preheating time that are determined by a preliminary experiment.
(Exemplary Embodiment 15)
Referring to FIGS. 14 and 15, exemplary embodiment 15 of the invention
will be described. In FIG. 14, instead of temperature sensor
5c shown
in FIG. 12, warm-air convection generator
150 is connected to PC
8.
FIGS. 14 and 15 illustrate a machining apparatus and a flowchart of a machining
method in accordance with the present embodiment. First, solder cream
159
is applied to substrate
160, and component
158 is mounted on substrate
160, as shown in FIG. 22. When workpiece
13 is placed on table
5a,
warm-air convection generator
150 blows warm air above workpiece
13,
as shown in FIGS. 14 and 15. Since heating device
5b heats table
5a, workpiece
13 is preheated when being placed.
After a lapse of a predetermined time (preheating time), camera
9, image
recognition device
10, and PC
8 identify a reference position. If
the reference position cannot be identified, an error is output to stop machining.
If the reference position is identified, PC
8 determines the amount of deviation
between the reference position and a given taught position, and corrects whole
data of irradiation positions.
According to the corrected data, XY(Z) table
6 moves workpiece
13
to a first irradiation position. After irradiation of a predetermined light energy
for a predetermined time, workpiece
13 is moved to a second irradiation
position. The moving of workpiece
13 and the irradiation of the light energy
are thus repeated until an Nth irradiation position (where N is the total number
of irradiation positions) is reached. Machining of workpiece
13 terminates
when the irradiation for the N-th position is completed.
The preheating performed by heating device
5b and the heating performed
by warm-air convection generator
150 remove hygroscopic component from solder
cream
159 and facilitate removal of an oxide film caused by melting flux.
Moreover, solvent contained in the solder cream can be vaporized and reduced in
a short time. Further, the convection generated above workpiece
13 by warm-air
convection generator
150 prevents the evaporated solvent from remaining
above workpiece
13.
Since the preheating lasts for a short time, oxidation of solder component
of the solder during the preheating time is negligible. Thus, the solvent does
not burst by expanding during vaporization even when only a joint is heated quickly
by the light energy. For this reason, high-quality soldering without scattering
of a solder ball can be performed.
(Exemplary Embodiment 16)
FIG. 16 is an enlarged view of local-preheating
151, which partially
heats a workpiece in a machining apparatus in accordance with exemplary embodiment
16. As shown in FIG. 12, a partial non-contact part
152 which does not contact
is provided between workpiece
13 and local preheating table
151,
and is hardly heated. For example, if bare IC chip
153 is already mounted
on substrate
160 of workpiece
13 in another process, the quality
of bare IC chips
153 may decline when its temperature is raised. Non-contact
part
152 prevents such a component from being preheated.
Thus, high-quality soldering with light energy only for a necessary position
without scattering of a solder ball is performed even when, for example, bare IC
chip
153, which has a quality declining according to its temperature rise,
is already mounted on substrate
160 of workpiece
13 in another process.
(Exemplary Embodiment 17)
FIG. 17 is an enlarged view of overall-heating device
154 which entirely
heats a workpiece in a machining apparatus in accordance with exemplary embodiment
17. As shown in FIG. 13, overall heating device
154 covers a workpiece and
includes glass
155 provided at its upper portion which permits a light energy
to pass, and lamps
156 provided at its both sides which function as heat
sources. Overall heating device
154 is mounted to XY(Z) table
6 and
is hence movable. Lamps
156 are controlled to be turned on and off so that
the temperature of workpiece
13 detected by the temperature sensor
5c
is maintained at a predetermined temperature. In this way, workpiece
13
is entirely heated, so that high-speed and uniform preheating can be performed,
and the light energy allows short-time and high-quality soldering without scattering
of a solder ball.
(Exemplary Embodiment 18)
Referring to FIGS. 18 and 19, exemplary embodiment 18 of the present invention
will be described. In FIG. 18, instead of temperature sensor
5c used
in a machining apparatus of FIG. 12, local-hot-air generator
157 is used
together with a condenser.
FIGS. 18 and 19 illustrate a machining apparatus and a flowchart of a machining
method in accordance with the present embodiment. First, solder cream
159
is applied to substrate
160, and component
158 is mounted on substrate
160, as shown in FIG. 22. Then, workpiece
13 is placed on table
5a,
as shown in FIGS. 14 and 15. Next, camera
9, image recognition device
10,
and PC
8 identify a reference position. If the reference position cannot
be identified, an error is output to stop machining. If the reference position
is identified, it is determined whether or not the reference position is deviated
from a given taught position. If there is a deviation, PC
8 corrects whole
data of irradiation positions based on the amount of the deviation. In accordance
with the corrected data, XY(Z) table
6 moves workpiece
13 to a first
hot-air blow position.
After local-hot-air genera
