Title: Method and computer software product for calculating and presenting a numerical value representative of a property of a circuit
Abstract: To calculate pin-to-pin delay time, which is delay time from the input pin to the output pin of a logic block, and block-to-block delay time, which is delay time from an output pin of one block to an input pin of the next block, firstly, the pin-to-pin delay time and the block-to-block delay time are calculated with negligence in aging caused by a hot carrier effect, secondly, degradations caused by aged transistors connected to the input pin and the output pin, and lastly, the pin-to-pin delay time and block-to-block delay time are modified by the degradation rate.
Patent Number: 6,975,979 Issued on 12/13/2005 to Akimoto,   et al.
| Inventors:
|
Akimoto; Tetsuya (Tokyo, JP);
Hirata; Morihisa (Tokyo, JP)
|
| Assignee:
|
NEC Corporation (Tokyo, JP)
|
| Appl. No.:
|
347409 |
| Filed:
|
July 6, 1999 |
Foreign Application Priority Data
| Jul 06, 1998[JP] | 10-190685 |
| Current U.S. Class: |
703/19; 703/2; 703/13; 702/117; 716/6 |
| Intern'l Class: |
G06F 017/50 |
| Field of Search: |
703/19,13,2
702/117
716/6
|
References Cited [Referenced By]
U.S. Patent Documents
| 5446676 | Aug., 1995 | Huang et al.
| |
| 5615377 | Mar., 1997 | Shimizu et al.
| |
| 5841672 | Nov., 1998 | Spyrou et al.
| |
| 5852445 | Dec., 1998 | Yoshikawa et al.
| |
| 5974247 | Oct., 1999 | Yonezawa.
| |
| 6047247 | Apr., 2000 | Iwanishi et al.
| |
| 6278964 | Aug., 2001 | Fang et al.
| |
| Foreign Patent Documents |
| 9-260498 | Oct., 1997 | JP.
| |
| 10-124565 | May., 1998 | JP.
| |
| 10-228497 | Aug., 1998 | JP.
| |
| 11-154168 | Jun., 1999 | JP.
| |
Other References
Quader et al., "Hot-carrier-reliability design guidelines for CMOS logic circuits",
IEEE Journal of Solid-State Circuits, vol. 29, Issue 3, Mar. 1994, pp 253-262.
Minehane et al., "Direct BSIM3v3 parameter extraction for hot-carrier reliability
simulation of N-channel LDD MOSFETs", Proceedings of the 1997 6th International
Symposium on Physical & Failure Analysis of Integrated Circuits, 1997, pp 133-139.
Translated copy of "Reason For Rejection", Japanese Office Action, Jul. 12, 2000.
|
Primary Examiner: Homere; Jean R.
Assistant Examiner: Day; Herng-der
Attorney, Agent or Firm: Sughrue Mion, PLLC
Claims
1. A method of calculating, by the use of a computer, pin-to-pin delay time T
iopath—aged,
which is delay time of a signal passing between an input pin and an output pin
of a logic block, and block-to-block delay time T
connect—aged,
which is delay time of a signal passing between two said logic blocks connected
to each other, comprising:
(a) calculating an amount of stress S
in cast by the input pin and
an amount of stress S
out cast by the output pin according to the following
expression:
##EQU28##
where a load capacitance is represented by C[pF], constants depending on change
of inputted waveform are represented by α and β, and width of channel
of a transistor connected to a pin is represented by W[μm];
(b) calculating an aged delay time of the input pin δ
in[%] and
an aged delay time of the output pin δ
out[%] according to the
following expression:
##EQU29##
where a constant depending on physical structure of the pin is represented γ,
the term of guarantee of a LSI is represented by τ[hour], constants depending
on process are represented by ε
1, ε
2 and κ, working
frequency is represented by f[Hz], and absolute temperature is represented by T[K];
(c) calculating and outputting for use as values representative of circuit properties
of a logic level circuit the pin-to-pin delay time T
iopath—aged
and the block-to-block delay time T
connect—aged
according to the following expressions:
where pin-to-pin delay time and block-to-block delay time calculated ignoring
aging caused by hot carrier effect are represented by T
iopath—fresh[ps]
and T
connect—fresh[ps], and
ratios of delay times occurred at an input stage and an output stage to whole delay
time occurred from the input pin to the output pin are represented by λ
in
and λ
out.
2. A method of calculating, by the use of a computer, a delay time occurred to
a signal passing through a logic level circuit that consists of a plurality of
logic blocks, comprising:
(a) calculating pin-to-pin delay time T
iopath—aged,
which is delay time of a signal passing between an input pin and an output pin
of a bale block, and block-to-block delay time T
connect—aged,
which is delay time of a signal passing between two said logic blocks connected
to each other, comprising:
(i) calculating an amount of stress S
in cast by the input pin and
an amount of stress S
out cast by the output pin according to the following
expression:
##EQU30##
where a load capacitance is represented by C[pF], constants depending on change
of inputted waveform are represented by α and β, and width of channel
of a transistor connected to a pin is represented by W[μm];
(ii) calculating an aged delay time of the input pin δ
in[%]
and an aped delay time of the output pin δ
out[%] according to
the following expression:
##EQU31##
where a constant depending on physical structure of the pin is represented by
γ, the term of guarantee of a LSI is represented by τ [hour], constants
depending on process are represented by ε
1, ε
2 and κ,
working frequency is represented by f[Hz], and absolute temperature is represented
by T[K];
(iii) calculating and outputting for use as values representative of circuit
properties of the logic level circuit the pin-to-pin delay time T
iopath—aged
and the block-to-block delay time T
connect—aged
according to the following expressions:
where pin-to-pin delay time and block-to-block delay time calculated ignoring
aging caused by hot carrier effect are represented by and T
iopath—fresh[ps]
and T
connect—fresh[ps], and
ratios of delay times occurred at an input stage and an output stage to whole delay
time occurred from the input pin to the output pin are represented by λ
in,
and λ
out; and
(b) calculating and outputting for use as a value representative of a circuit
property of said logic level circuit the delay time of the logic level circuit
from the result of step (a).
3. A computer-readable medium incorporating a program of instructions for calculating,
by using a computer, pin-to-pin delay time T
iopath—aged,
which is delay time of a signal passing between an input pin and an output pin
of a logic block, and block-to-block delay time T
connect—aged,
which is delay time of a signal passing between two said logic blocks connected
to each other, the program making a computer execute the following processes:
(a) calculating an amount of stress S
in cast by the input pin and
an amount of stress S
out cast by the output pin according to the following
expression:
##EQU32##
where a load capacitance is represented by C[pF], constants depending on change
of inputted waveform are represented by α and β, and width of channel
of a transistor connected to a pin is represented by W[μm];
(b) calculating an aged delay time of the input pin δ
in[%] and
an aged delay time of the output pin δ
out[%] according to the
following expression:
##EQU33##
where that a constant depending on physical structure of the pin is represented
by γ, the term of a guarantee of a LSI is represented by τ[hour], constants
depending on process are represented by ε1, ε2 and κ, working
frequency is represented by f[Hz], and absolute temperature is represented by T[K];
(c) calculating and outputting for use as values representative of circuit properties
of a logic level circuit the pin-to-pin delay time T
iopath—aged
and the block-to-block delay time T
connect—aged
according to the following expressions:
where pin-to-pin delay time and block-to-block delay time calculated ignoring
aging caused by hot carrier effect are represented by T
iopath—fresh[ps]
and T
connect—fresh[ps], and
ratios of delay times occurred at an input stage and an output stage to whole delay
time occurred from the input pin to the output pin are represented by λ
in
and λ
out, respectively.
4. A computer-readable medium incorporating a program of instructions for calculating
a delay time occurred to a signal passing through a logic level circuit that consists
of a plurality of logic blocks, the program making a computer execute the following processes:
(a) calculating pin-to-pin delay time T
iopath—aged,
which is delay time of a signal passing between an input pin and an output pin
of a logic block, and block-to-block delay time T
connect—aged,
which is delay time of a signal passing between two said logic blocks connected
to each other, said calculating comprises:
(i) calculating an amount of stress S
in cast by the input pin and
an amount of stress S
out cast by the output pin according to the following
expression:
##EQU34##
where a load capacitance is represented by C[pF], constants depending on change
of inputted waveform are represented by α and β, and width of channel
of a transistor connected to a pin is represented by W[μm];
(ii) calculating an aged delay time of the input pin δ
in[%]
and an aged delay time of the output pin δ
out[%] according to
the following expression:
##EQU35##
where that a constant depending on physical structure of the pin is represented
by γ, the term of a guarantee of a LSI is represented by τ [hour],
constants depending on process are represented by ε
1, ε
2
and κ, working frequency is represented by f[Hz], and absolute temperature
is represented by T[K];
(iii) calculating and outputting for use as values representative of circuit
properties of said logic level circuit the pin-to-pin delay time T
iopath—aged
and the block-to-block delay time T
connect—aged
according to the following expressions:
where pin-to-pin delay time and block-to-block delay time calculated ignoring
aging caused by hot carrier effect are represented by T
iopath—fresh[ps]
and T
connect—fresh[ps], and
ratios of delay times occurred at an input stage and an output stage to whole delay
time occurred from the input pin to the output pin are represented by λ
in
and λ
out, respectively; and
(b) calculating and outputting for use as a value representative of a circuit
property of said logic level circuit the delay time of the logic level circuit
from to result of step (a).
Description
BACKGROUND OF THE INVENTION
This invention relates to a method of designing a semiconductor integrated circuit,
and, in particular, to a method of verifying reliability of the semiconductor integrated circuit.
In a semiconductor integrated circuit, a delay time is caused to occur in an
electronic
circuit when the electronic circuit includes MOS (Metal Oxide Semiconductor) transistors.
Recent years, MOS transistors tend to become very small in size. This makes it
impossible to ignore an influence from a hot carrier effect. Moreover, the delay
time is also varied by an influence of aging caused by the hot carrier effect.
In a conventional calculation method of the aged delay time, a difference, namely,
a degradation rate between delay times before and after aging is calculated from
information (input pin information) concerned with each input pin of a logic block
and information (input pin device information) concerned with a device connected
to the input pin. Hereinafter, the difference or a degradation rate will be called
an delay time degradation rate. And then, the aged delay time is calculated from
the delay time degradation rate.
Herein, input pin information concerned with rounding and a frequency of
waveform inputted to a logic block is provided from a logic level circuit formed
by the logic blocks. On the other hand, input pin device information is provided
from devices inside of a logic block.
The conventional calculation method will be described in detail with reference
to FIG. 1 and is specified by a delay time calculation method depicted by
100.
The delay time calculation method is for calculating aged delay time of a logic
level circuit. In this method, delay time degradation rate calculation
105
is executed to calculate the aging degradation amount or rate which occurs in one
logic block. Such the delay time degradation rate calculation
105 is carried
out on the basis of input pin information
102, passage time information
103 and input pin device information
104. The calculation
105
is iterated to all of logic blocks comprising a logic level circuit. From the result
of repeated calculation
105, aged delay time calculation
106 is executed
and finally, a calculation result
107 is gained.
As mentioned above, in the conventional method of calculating aged delay time
of a logic level circuit, the aged delay time of each logic blocks is based only
on the input pin information and then the result is applied for a calculation of
aged delay time of whole of the logic level circuit. In this method, the accuracy
of the aged delay time is low except that each logic block is composed of an inverter
of one-stage transistor gate.
In another conventional method, the aged delay time can be obtained with a high
accuracy. However, to accomplish such a high accuracy, each of the logic blocks
should be separated into a great number of transistor gates to calculate rounding
and a frequency of waveform through each transistor gate, instead of calculating
the aging degradation amount at each logic block. Specifically, the calculation
of aged delay time should be executed each of all transistors included in a logic
level circuit. In short, high accuracy and a small amount of calculation have a
tradeoff relationship in these methods.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide methods and computer software
products for calculating an aged delay time of a logic level circuit caused by
the hot carrier effect, with both high accuracy and little calculation.
According to this invention, a method for calculating a numerical value
V
A, which shows a property of a logic level circuit, from a numerical
value V
B, which shows a property of a logic block constituting the logic
level circuit, comprises the following steps:
(a) calculating the VB from numerical value VC's each
of which shows property of a transistor constituting part of the logic block; and,
(b) calculating the VA from the VB.
In the above mentioned method at step (a), one V
C may show a property
of a transistor connected to an input pin of the logic block and another V
C
may show a property of a transistor connected to an output pin of the logic block.
According to this invention, a method for calculating a delay time of a
signal passing through a logic level circuit is provided. The logic level circuit
consists of a plurality of logic blocks. This method calculates the delay time
from pin-to-pin delay time, which is delay time of a signal passing between an
input pin and an output pin of a logic block, and block-to-block delay time, which
is delay time of a signal passing between two logic blocks connected to each other.
Furthermore, this method comprises the following steps:
(a) calculating the pin-to-pin delay time and the block-to-block delay time
without calculating in aging caused by hot carrier effect;
(b) calculating variations of delay times that signals pass through transistors
connected to the input and output pin caused by said aging; and,
(c) modifying the pin-to-pin delay time and the block-to-block delay time
calculated in step (a) by the variations calculated in step (b).
According to this invention, a method for calculating pin-to-pin delay
time T
iopath—aged and block-to-block
delay time T
connect—aged is
provided. The pin-to-pin delay time T
iopath—aged
is delay time of a signal passing between an input pin and an output pin
of a logic block. The block-to-block delay time T
iopath—aged
is delay time of a signal passing between said two logic blocks connected
to each other. Furthermore, this method comprises the following steps:
(a) calculating an amount of stress Sin cast by the input pin
and an amount of stress Sout cast by the output pin according to the
following expression:
##EQU1##
when it is assumed that a load capacitance is represented by C[pF], constants
depending on change of inputted waveform are represented by α and β,
and width of channel of the transistor connected to the pin is represented by W[μm];
(b) calculating an aged delay time of the input pin δin[%]
and an aged delay time δout[%] according to the following expression:
##EQU2##
when it is assumed that a constant depending on physical structure of the pin
is represented by γ, the term of a guarantee of the LSI is represented by
τ [hour], constants depending on process are represented by ε1
ε2 and κ, working frequency is represented by f[Hz], and
absolute temperature is represented by T[K];
(c) calculating the pin-to-pin delay time Tiopath—aged
and the block-to-block delay time Tconnect—aged
according to the following expressions:
when it is assumed that pin-to-pin delay time and block-to-block delay time
calculated ignoring aging caused by hot carrier effect are represented by Tiopath—fresh[ps]
and Tconnect—fresh[ps], and
ratios of delay times occurred at the input stage and the output stage to whole
delay time occurred from the input pin to the output pin are represented by λin
and λout.
According to this invention, a method for calculating a delay time occurred
to a signal passing through a logic level circuit that consists of a plurality
of logic blocks comprises the following steps:
(a) calculating delay times of all said logic blocks according to the method
mentioned above; and,
(b) calculating the delay time of the logic level circuit from the result
of step (a).
According to this invention, a computer software product for calculating
a numerical value V
A, which shows a property of a logic level circuit,
from a numerical value V
B, which shows a property of a logic block constituting
the logic level circuit makes a computer execute the following processes:
(a) calculating the VB from numerical value VC's each
of which shows property of a transistor constituting part of the logic block; and,
(b) calculating the VA from the VB.
In the above mentioned computer software product at process (a), one V
C
may show a property of a transistor connected to an input pin of the logic block
and another V
C may show a property of a transistor connected to an output
pin of the logic block.
According to this invention, a computer software product for calculating
a delay time of a signal passing through a logic level circuit that consists of
a plurality of logic blocks is provided. This computer software product calculates
a delay time from pin-to-pin delay time and block-to-block delay time. The pin-to-pin
delay time is delay time of a signal passing between an input pin and an output
pin of a logic block. The block-to-block delay time is delay time of a signal passing
between two logic blocks connected to each other. Furthermore, the computer software
product makes a computer execute the following processes:
(a) calculating the pin-to-pin delay time and the block-to-block delay time
without calculating in aging caused by hot carrier effect;
(b) calculating variations of delay times that signals pass through transistors
connected to the input and output pin caused by said aging; and,
(c) modifying the pin-to-pin delay time and the block-to-block delay time
calculated in step (a) by the variations calculated in step (b).
According to this invention, a computer software product for calculating
pin-to-pin delay time T
iopath—aged
and block-to-block delay time T
iopath—aged
is provided. The pin-to-pin delay time T
iopath—aged,
is delay time of a signal passing between an input pin and an output pin of a logic
block. The block-to-block delay time T
connect—aged,
which is delay time of a signal passing between said two logic blocks connected
to each other. And then, the computer software product makes a computer execute
the following processes:
(a) calculating an amount of stress Sin cast by the input pin
and and an amount of stress Sout cast by the output pin according to
the following expression:
##EQU3##
when it is assumed that a load capacitance is represented by C[pF], constants
depending on change of inputted waveform are represented by α and β,
and width of channel of the transistor connected to the pin is represented by W[μm];
(b) calculating an aged delay time of the input pin δ in [%] and an
aged delay time δ out [%] according to the following expression:
##EQU4##
when it is assumed that a constant depending on physical structure of the pin
is represented by γ, the term of a guarantee of the LSI is represented by
τ [hour], constants depending on process are represented by ε1
ε2 and κ, working frequency is represented by f[Hz], and
absolute temperature is represented by T[K];
(c) calculating the pin-to-pin delay time Tiopath—aged
and the block-to-block delay time Tconnect—aged
according to the following expressions:
when it is assumed that pin-to-pin delay time and block-to-block delay time
calculated ignoring aging caused by hot carrier effect are represented by Tiopath—fresh[ps]
and Tconnect—fresh[ps], and
ratios of delay times occurred at the input stage and the output stage to whole
delay time occurred from the input pin to the output pin are represented by λin
and λout.
According to this invention, a computer software product for calculating
a delay time occurred to a signal passing through a logic level circuit that consists
of a plurality of logic blocks makes a computer execute the following processes:
(a) calculating delay times of all said logic blocks according to the above-mentioned
product; and,
(b) calculating the delay time of the logic level circuit from the result
of step (a).
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 shows a block diagram for use in schematically describing a conventional
method for calculating an aged delay time of a logic level circuit;
FIG. 2 shows an relationship among inner information of a logic block, outskirts
information of a logic block, a pin-to-pin delay time and a block-to-block delay time;
FIG. 3 shows a block diagram for use in schematically describing a method for
calculating an aged delay time of a logic level circuit comprising logic blocks
in accordance with the present invention;
FIG. 4 shows a block diagram for use in schematically describing a method for
calculating aged delay time of a logic level circuit in aging caused by the hot
electron effect;
FIG. 5 shows a diagram for use in schematically describing propagation delay
time tpd when input of inverter changes from low level to high level; and
FIG. 6 shows a diagram for use in schematically describing delay time of a logic
block comprising three stage inverters.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
(1) First Embodiment
Referring to FIG. 2, description will be made about a method according
to a first embodiment of the present invention, which is used to calculate an delay
time of a logic block. The logic block includes N-channel transistors. With the
passage of time, all of the N-channel transistors are aged and suffer from degradation
in delay time due to a hot carrier effect, especially, a hot electron effect.
According to the inventors' experimental studies, it has been found out
that the N-channel transistors in the part shown by the question mark "?" in FIG.
2 scarcely influence rounding (wave distortion) of waveform and load capacitance
because distances between the transistors are short on one hand. On the other hand,
it has been also found out that the N-channel transistors Tr
211 and Tr
221 connected directly to the input and output pin tend to seriously influence
these effects as a result of layout and connection design of a logic circuit. Consequently,
it is very effective to calculate the effect of hot electron only in connection
with the N-channel transistor Tr
211 and Tr
221.
In general, a logic level circuit is divided into a plurality of logic blocks
which may be considered as a minimum unit of the logic level circuit. In this event,
it is necessary to acquire information concerning inner transistors for the calculation
at every one of the logic blocks. In consequence, aged degradation amounts or rates
between delay times before and after aging of Tr
211 and Tr
221 are
calculated on the basis of information about load capacitance
212, rounding
of waveform
214 caused by inner circuit of a logic block, the size of N-channel
transistor, and coefficient for calculating delay time degradation rate.
The delay time degradation rate of an input pin δ
in(%) is calculated
by the next expression:
##EQU5##
γin: constant depending on physical structure of the input pin;
τac(hour): guaranteed duration of LSI;
Sin: stress of input pin;
fin (Hz): frequency at input pin; and
T (K): absolute temperature.
S
in is calculated by the next expression:
Cin(pF): load capacitance of transistor connected to input pin;
##EQU6##
α,β: constants depending on rounding of waveform of input pin; and
Win(μm): width of N-channel transistor connected to input pin.
The delay time degradation rate of output pin δ
in(%) is calculated
by the next expression:
γout: Out constant depending on physical structure of output
pin;
##EQU7##
Sout: stress of output pin; and
fout(Hz); frequency at output pin.
##EQU8##
To modify pin-to-pin delay time for delay time degradation rate caused by the
hot electron effect, the delay time degradation rate of Tr
211, which is
connected to the input pin, is considered to calculate the pin-to-pin delay time.
Similarly, the delay time degradation rate of Tr
221, which is connected
to the output pin, is considered to calculate both the pin-to-pin delay time and
the block-to-block delay time. According to this concept, it is possible to calculate
pin-to-pin delay time and block-to-block delay time modified for the hot electron
effect. Pin-to-pin delay time T
iopath—aged(ps)
modified for delay time degradation rate and block-to-block delay time T
connect—aged(ps)
modified for delay time degradation rate are given by the next expressions:
λin: the ratio of the delay time occurred at the input
pin to the delay time between the input pin and the output pin; and
λout: the ratio of the delay time occurred at the output
pin to the delay time between the input pin and the output pin.
(2) Second Embodiment
Next, description will be made about a method for calculating delay time of
a logic level circuit, which is the second embodiment of the present invention
referring to FIG. 3. In this method, the logic level circuit comprises a plurality
of logic blocks.
By giving attention to one logic block included in the logic level circuit, the
input pin information
302, passage time information
303 and input
pin device information
304 are assembled. The passage time information
303
is given in the form of year. And then, the delay time degradation rate, which
is caused to occur at the N-channel transistor connected to the input pin of the
logic block, is calculated in the delay degradation calculation
305. Herein,
the input pin information
302 is part of circuit information
301
calculated for the logic level circuit according to the input pin. And herein,
the input pin device information
304 is concerned with an inside circuit
of the logic block.
Similarly to the delay time degradation rate calculation
305, the
delay time degradation rate related to the output pin is calculated in the delay
time degradation rate calculation
308. By paying attention to one logic
block included in the logic level circuit, the passage time information
303,
the output pin information
306, and output pin device information
307
are assembled. And then, the delay time degradation rate, which is occurred at
the N-channel transistor connected to the output pin of the logic block, is calculated
in the delay time degradation rate calculation
308. Herein, the output pin
information
306 is part of circuit information
301 calculated for
the logic level circuit according to the output pin. And herein, the output pin
device information
307 is concerned with devices of the logic block.
The results of the delay time degradation rate calculation
305 and
308
are used or applied in the pin-to-pin delay time calculation
309. Furthermore,
the result of the calculation
308 is given to the block-to-block delay time
calculation
310. Finally, the calculation result
311 is acquired
from the result of the pin-to-pin delay time calculation
309 and the block-to-block
delay time calculation
310.
(3) Third Embodiment
Next, description will be made about the third embodiment of the present invention
referring to FIG. 4. This embodiment is a method for calculating delay time of
a logic level circuit when the delay time is aged because of the hot electron effect.
At first, delay time calculation
402 and operating frequency calculation
403 are executed on the basis of logic level circuit information
401.
On the one hand, the delay time calculation
402 is a conventional method
for calculating delay time without reference to the hot electron effect. And the
delay time calculation
402 calculates rounding of waveform at input pin,
load capacitance at output pin, pin-to-pin delay time, and block-to-block delay
time by each of logic block included in the logic level circuit. On the other hand,
the operating frequency calculation
403 is a kind of method for calculating
operating frequency by using a probability propagation technique. And the operating
frequency calculation
403 calculates frequency with which input and output
pin of each logic block in the logic level circuit are driven.
The result of the delay time calculation
402 is produced as input pin
information
404 and delay time
406. The result of the operating frequency
calculation
403 is produced as output pin information
405. The input
pin information
404 comprises rounding of waveform and operating frequency
at the input pin. The output pin information
405 comprises load capacitance
and operating frequency at the output pin. The delay time
406 comprises
both pin-to-pin delay time and block-to-block delay time.
In addition to the input pin information
404 and output pin information
405, input pin device information
407 and output pin device information
408 are used in delay time degradation rate calculation
409 and
410.
The input pin device information
407 is concerned to inside of a logic block,
and herein, shows some coefficients of expression (1) and (2) like as channel width
of N-channel transistor connected to input pin.
The delay time degradation rate calculation
409 and
410 calculate
degradation rate between delay times before and after passing time from rounding
of inputted waveform, output load capacitance, operating frequency, and size of
N-channel transistor of input and output pin. According to the expression (1) and
(2), the calculation
409 calculates the degradation rate of input pin in
application of rounding of waveform at input pin calculated in the delay time calculation
402, operating frequency calculated in the frequency calculation
403,
and the size of N-channel transistor connected to input pin and other coefficients
assembled from the input pin device information
407. Similarly, according
to the expression (3) and (4), the calculation
410 is for calculating the
degradation of output pin in application of load capacitance at output pin, operating
frequency calculated in the frequency calculation
403, and the size of N-channel
transistor connected to output pin and other coefficients assembled from the output
pin device information
408.
After execution of the delay time degradation calculation
409 and
410,
pin-to-pin delay time degradation
411 is calculated from the degradations
of input and output pins. Similarly, block-to-block delay time degradation
412
is calculated from the degradation of output pin. Referring to these degradations,
delay time modification
413 is executed to modify the delay time
406
calculated in the delay time calculation
402 according to the expression
(5) and (6). Finally, calculation result
414 is calculated.
(4) Derivation of Expressions
Hereinafter, description will be made about how to derive the expressions
from (1) to (6).
(4-1) Derivation of the Expression (1) and the Expression (3)
In MOS transistor, degradation caused by hot carriers exponentially progresses
in accordance DC stress time t
dc. The degradation is denoted by D and
is given by:
In the above expression, n and A depend on process and bias.
On the other hand, the degradation D is given by the following expressions with
drain current I
ds and mutual conductance g
m:
##EQU9##
Furthermore, the degradation D is shown by:
##EQU10##
In the above, W is the channel width of transistor. B and m depend on process
and bias. The expression (10) is proposed by C. Hu (C. Hu et al. IEEE Transaction
on Electron Devices Vol. ED-32, No. 2, pp375, 1985).
When a value "age" is given by the next expression:
##EQU11##
the age under DC bias stress ageDC(t
dc) is given by the following:
##EQU12##
and the age under AC bias stress ageAC(t
ac) is given by the following:
##EQU13##
In the case where AC bias has an interative waveform at a period T, the expression
(13) is transformed into:
##EQU14##
On the condition that DC stress is equal to AC stress, the following holds:
By making a substitution the expressions (12) and (14) for the expression (15),
assuming that f=1/T, the following expressions (16) and (17) hold:
##EQU15##
In the case where the objective circuit of the calculation is like an inverter
on the conditions that the voltage of inputted signal changes from 0 to V
DD
(V
DD to 0), and the voltage of output signal changes from V
DD to
0 (0 to V
DD), the following holds:
˜0:input=0 or
VDD, output=0 or
VDD (18)
When an input signal changes from low level to high level, a transmission delay
time in the inverter shown in FIG. 4 is mainly decided by N-channel transistor's
ability to drive current and is shown in the following expression:
##EQU16##
a: constant; and
C: load capacitance of output.
Herein, when mobility is μ
n, capacitance of gate oxide film
is C
ox, width of gate is W and length of gate is L, K
n is
given by:
##EQU17##
Because of degradation caused by the hot carrier effect, the following expression
holds in the case that when K
n of N-channel transistor decreases by
ΔK
n, t
pd increases by δ:
##EQU18##
From the expression (7), ΔK
n is given by:
From the expression (21), δ=γΔK
n. Consequently,
the following holds:
##EQU19##
From the expression (17) and expression (23), the following holds:
In the expression (24), A is a parameter depending on temperature.
For example, the expression (24) is shown from an actual measurement as the following:
Herein, A, t
ac and n are substituted like the following:
##EQU20##
In the consequent, the following is acquired.
##EQU21##
(4-2) Derivation of Expression (2) and Expression (4)
Stress S depends on the ratio of load capacitance C to width of transistor(s),
which is (are) N-channel transistor or (and) P-channel transistor, rise time T
r
and fall time T
f of input pin. Stress S is shown in the following function:
##EQU22##
S is computed by calculation of the following expression in a circuit simulation
by the use of SPICE and the like by changing C/W, T
r and T
f.
##EQU23##
When S is approximated in the expression (29) by a function of C/W, the following
is gained:
##EQU24##
where α and β are constants depending on structure of circuit,
T
r and T
f.
(4-3) Derivation of the Expression (5) and (6)
In a logic block comprising three stage inverters each of which has the same
delay
time, when the input changes from low level to high level, λ is shown by
the following:
##EQU25##
and when the input changes from high level to low level, λ is shown by
the following:
Similarly to FIG. 6, in four stage inverters each of which has the same
delay time, when the input changes from low level to high level, λ is shown
by the following:
##EQU26##
and when the input changes from high level to low level, λ is shown by
the following:
##EQU27##
(5) Effect of the Present Invention
Delay time degradation which occurs in a logic circuit owing to the hot electron
effect is serious in a transistor which has large rounding of inputted waveform
or large load capacitance of output.
A logic circuit inside a logic block is previously arranged and wired on LSI
in
small area so that transistors inside of the block have small rounding of input
waveform and load capacitance of output. On the other hand, transistors connected
to the input/output pin of a logic block tend to have large rounding of input waveform
and load capacitance of output because distance between logic blocks and length
of wires between logic blocks are determined by a tool for arranging and wiring LSI.
Therefore, it is possible to calculate accurately an degradation rate
of delay time in a logic circuit caused in the hot electron effect by paying attention
to the input and output pin of a logic block.
Namely, the present invention firstly calculates delay time degradation rate
of an input pin and an output pin, and secondly modifies delay time by the delay
time degradation rate. In consequence, the present invention provides a delay time
calculation method with both high accuracy and low cost of calculation. The method
of the present invention is immediately available for circuit simulation, static
timing analysis.
While this invention has thus far been described in conjunction with a few
embodiments thereof, it will be readily possible for those skilled in the art to
put this into various other manners.
*