Senior Fitness - Exercise and Nutrition for Aging Men and Women
FREE Article Feed for your website.
Home Ownership Magazine
Party Planning Information
Article Marketing Resources
Bio-Medical Research Article Database
Informative Articles on Life, Love and Happiness
Tutorials on Business to Writing
Famous Quotes from Famous People
Song Lyric Information
New US Patent Information
Comprehensive List of Content by Category
Online Auctions and Shopping Related Articles
Article Search
Most Recent Articles
Title: Method and apparatus for establishing manufacturer-specific test writing parameters for writing of writable optical storage media
Patent Number: 7,436,745 Issued on 10/14/2008 to Kim

Title: Optical memory device
Patent Number: 7,436,744 Issued on 10/14/2008 to Nakajo

Title: Optical recording method and medium on which recording and/or reading are performed from one side
Patent Number: 7,436,743 Issued on 10/14/2008 to Kubo,   et al.

Title: Optical recording device and aberration correction method
Patent Number: 7,436,742 Issued on 10/14/2008 to Yanagawa

Title: Optical disc unit, optical disc recording method, and optical disc
Patent Number: 7,436,741 Issued on 10/14/2008 to Nagai,   et al.

Title: Wobble detection for playback of optical recording media
Patent Number: 7,436,740 Issued on 10/14/2008 to Lo Muzio,   et al.

Title: Optical disk drive and correcting method for differential push-pull tracking error signals of the optical disk drive
Patent Number: 7,436,739 Issued on 10/14/2008 to Ou Yang

Title: Play-back device
Patent Number: 7,436,738 Issued on 10/14/2008 to Yamasaki,   et al.

Title: Electric timepiece
Patent Number: 7,436,737 Issued on 10/14/2008 to Fukuda,   et al.

Title: Hydrophone array module
Patent Number: 7,436,736 Issued on 10/14/2008 to Schneider,   et al.

Title: Method for seismic processing, in particular for compensating birefringence on seismic traces
Patent Number: 7,436,735 Issued on 10/14/2008 to Garotta

Title: Shaped high frequency vibratory source
Patent Number: 7,436,734 Issued on 10/14/2008 to Krohn

Title: System for performing read operation on non-volatile storage with compensation for coupling
Patent Number: 7,436,733 Issued on 10/14/2008 to Mokhlesi

Title: Internal power supply generating circuit without a dead band
Patent Number: 7,436,732 Issued on 10/14/2008 to Hirobe

Title: Semiconductor device and method for driving the same
Patent Number: 7,436,731 Issued on 10/14/2008 to Iwata

Title: Method and device for controlling internal power voltage, and semiconductor memory device having the same
Patent Number: 7,436,730 Issued on 10/14/2008 to Cho

Title: Fuse circuit and semiconductor device using fuse circuit thereof
Patent Number: 7,436,729 Issued on 10/14/2008 to Yoshida,   et al.

Title: Fast random access DRAM management method including a method of comparing the address and suspending and storing requests
Patent Number: 7,436,728 Issued on 10/14/2008 to Harrand,   et al.

Title: Method and apparatus to control a power consumption of a memory device
Patent Number: 7,436,727 Issued on 10/14/2008 to Jain,   et al.

Title: Circuit for and method of reading data in an asynchronous FIFO including a backup address circuit for re-reading data
Patent Number: 7,436,726 Issued on 10/14/2008 to Lovejoy

Title: Data generator having stable duration from trigger arrival to data output start
Patent Number: 7,436,725 Issued on 10/14/2008 to Miki

Title: Method and system for independent control of voltage and its temperature co-efficient in non-volatile memory devices
Patent Number: 7,436,724 Issued on 10/14/2008 to Nandi

Title: Method for two-cycle sensing in a two-terminal memory array having leakage current
Patent Number: 7,436,723 Issued on 10/14/2008 to Rinerson,   et al.

Title: Semiconductor device
Patent Number: 7,436,722 Issued on 10/14/2008 to Mizuno,   et al.

Title: Supplying voltage to a bit line of a memory device
Patent Number: 7,436,721 Issued on 10/14/2008 to Lehmann,   et al.

Title: Semiconductor memory device
Patent Number: 7,436,720 Issued on 10/14/2008 to Nobutoki,   et al.

Title: Auto-precharge signal generating circuit
Patent Number: 7,436,719 Issued on 10/14/2008 to Yun

Title: Semiconductor memory device including fuse detection circuit to determine successful fuse-cutting rate for optical fuse-cutting conditions
Patent Number: 7,436,718 Issued on 10/14/2008 to Tanaka,   et al.

Title: Semiconductor device having mechanism capable of high-speed operation
Patent Number: 7,436,717 Issued on 10/14/2008 to Hidaka

Title: Nonvolatile memory
Patent Number: 7,436,716 Issued on 10/14/2008 to Kishi,   et al.

Title: Non-volatile memory device, and control method of non-volatile memory device
Patent Number: 7,436,715 Issued on 10/14/2008 to Kato,   et al.

Title: Nonvolatile semiconductor memory
Patent Number: 7,436,714 Issued on 10/14/2008 to Yaegashi,   et al.

Title: Reducing the impact of program disturb
Patent Number: 7,436,713 Issued on 10/14/2008 to Hemink

Title: Nonvolatile memory device including circuit formed of thin film transistors
Patent Number: 7,436,712 Issued on 10/14/2008 to Ogura,   et al.

Title: Semiconductor memory device
Patent Number: 7,436,711 Issued on 10/14/2008 to Cho,   et al.

Title: EEPROM memory device with cell having NMOS in a P pocket as a control gate, PMOS program/erase transistor, and PMOS access transistor in a common well
Patent Number: 7,436,710 Issued on 10/14/2008 to Ratnakumar,   et al.

Title: NAND flash memory with boosting
Patent Number: 7,436,709 Issued on 10/14/2008 to Higashitani

Title: NAND memory device column charging
Patent Number: 7,436,708 Issued on 10/14/2008 to Roohparvar

Title: Flash memory cell structure and operating method thereof
Patent Number: 7,436,707 Issued on 10/14/2008 to Hung,   et al.

Title: Method and apparatus for varying the programming duration and/or voltage of an electrically floating body transistor, and memory cell array implementing same
Patent Number: 7,436,706 Issued on 10/14/2008 to Popoff,   et al.

Title: Multiple level cell memory device with single bit per cell, re-mappable memory block
Patent Number: 7,436,705 Issued on 10/14/2008 to Roohparvar

Title: Non-volatile memory devices and method thereof
Patent Number: 7,436,704 Issued on 10/14/2008 to Kim,   et al.

Title: Active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices
Patent Number: 7,436,703 Issued on 10/14/2008 to Pham,   et al.

Title: Integrated circuit with a data memory protected against UV erasure
Patent Number: 7,436,702 Issued on 10/14/2008 to Naura,   et al.

Title: Single poly EPROM device with double control gates to prevent unintentionally charging/discharging
Patent Number: 7,436,701 Issued on 10/14/2008 to Oberhuber

Title: MRAM memory cell having a weak intrinsic anisotropic storage layer and method of producing the same
Patent Number: 7,436,700 Issued on 10/14/2008 to Ruehrig,   et al.

Title: Nonvolatile semiconductor memory device
Patent Number: 7,436,699 Issued on 10/14/2008 to Tanizaki,   et al.

Title: MRAM arrays and methods for writing and reading magnetic memory devices
Patent Number: 7,436,698 Issued on 10/14/2008 to Lin,   et al.

Title: Memory cell, memory using the memory cell, memory cell manufacturing method, and memory recording/reading method
Patent Number: 7,436,697 Issued on 10/14/2008 to Murakami,   et al.

Title: Wet cleaning process and wet cleaning equipment
Patent Number: 6,866,723 Issued on 03/15/2005 to Ueda,   et al.

Title: Iso-reflectance wavelengths
Patent Number: 7,120,553 Issued on 10/10/2006 to Benvegnu

Title: 4-formylamino-N-methylpiperidine derivatives, the use thereof as stabilizers and organic material stabilized therewith
Patent Number: 6,737,527 Issued on 05/18/2004 to Haremza,   et al.

Title: Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
Patent Number: 6,764,735 Issued on 07/20/2004 to Nee

Title: Multi-element electron-transfer optical detector system
Patent Number: 6,765,190 Issued on 07/20/2004 to Jordan

Title: Trenched gate non-volatile semiconductor method with the source/drain regions spaced from the trench by sidewall dopings
Patent Number: 6,764,904 Issued on 07/20/2004 to Liu,   et al.

Title: Magnetic resonance imaging coated assembly
Patent Number: 6,765,144 Issued on 07/20/2004 to Wang,   et al.

Title: Multichip module having chips on two sides
Patent Number: 6,765,152 Issued on 07/20/2004 to Giri,   et al.

Title: Method of producing information recording medium, production apparatus and information recording medium
Patent Number: 6,764,737 Issued on 07/20/2004 to Arakawa,   et al.

Title: Over-coating composition for photoresist, and processes for forming photoresist patterns using the same
Patent Number: 6,764,806 Issued on 07/20/2004 to Jung,   et al.

Title: One's complement cryptographic combiner
Patent Number: 6,760,440 Issued on 07/06/2004 to Driscoll

Title: Plasma deposited selective wetting material
Patent Number: 6,764,812 Issued on 07/20/2004 to Kubacki

Title: Recognizing film and video objects occuring in parallel in single television signal fields
Patent Number: 6,937,655 Issued on 08/30/2005 to De Haan,   et al.

Title: 3-D graphics chip with embedded DRAM buffers
Patent Number: 6,937,242 Issued on 08/30/2005 to Wu,   et al.

Title: Apparatus and method employed in disk drive to enable single signal line to be used for transmission of both read and control signals
Patent Number: 6,937,410 Issued on 08/30/2005 to Koyanagi

Title: Video encoder and/or decoder
Patent Number: 6,937,661 Issued on 08/30/2005 to Narita

Title: Method and apparatus for removing heat from a circuit
Patent Number: 6,937,471 Issued on 08/30/2005 to Haws,   et al.

Title: Apparatus and method for preventing an erroneous operation at the time of detection of a system failure
Patent Number: 7,117,397 Issued on 10/03/2006 to Kondo,   et al.

Title: Devices and methods for controlling movement of an electrosurgical electrode
Patent Number: 7,189,232 Issued on 03/13/2007 to Scholl,   et al.

Title: Prosthetic foot with oblique attachment
Patent Number: 6,911,052 Issued on 06/28/2005 to Christensen

Title: Method and apparatus for cleaning a gas
Patent Number: 6,899,750 Issued on 05/31/2005 to Hogan

Title: Channelized sorbent media, and methods of making same
Patent Number: 6,764,755 Issued on 07/20/2004 to Tom,   et al.

Title: Retractable spout assembly for bottles
Patent Number: 6,976,610 Issued on 12/20/2005 to Rigel

Title: Synthesis and use of alkylalkoxyacyloxysilanes and blends thereof for use as a crosslinking agent in moisture curing RTV'S
Patent Number: 6,737,494 Issued on 05/18/2004 to Sargent

Title: Cartridge for an information recording medium
Patent Number: 6,912,724 Issued on 06/28/2005 to Park,   et al.

Title: Endoscope system
Patent Number: 6,790,175 Issued on 09/14/2004 to Furusawa,   et al.

Portable power amplifier Number:7,133,705 from the United States Patent and Trademark Office (PTO) owispatent

Home    Author Login    Submit Article    Article Search    Add Your Link    Edit Your Link    Contact Us    Advertising    Disclaimer

   

 
Web LinkGrinder.com

Top Breaking News
     Greek, Cypriot Leaders Resume Unification Talks in Nicosia by Nathan Morley
     Indonesia Tobacco Sales Grow, Raising Health Fears
     South Korea Allows Top Defector to Travel Overseas by VOA News

Title: Portable power amplifier

Abstract: A portable power amplifier includes portable encapsulating cases, a printed board incorporated in those encapsulating cases, and a power amplifying device mounted on this printed board. An antenna switch and an antenna are provided near the power amplifying device, which is connected to those components in a pattern. This structure improves heat dissipation efficiency of the portable power amplifier.

Patent Number: 7,133,705 Issued on 11/07/2006 to Akatsuka,   et al.


Inventors: Akatsuka; Terumoto (Aichi, JP), Utsunomiya; Keisuke (Aichi, JP), Owaki; Haruki (Gifu, JP), Kitagawa; Motoyoshi (Gifu, JP)
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
Appl. No.: 10/343,966
Filed: May 23, 2002
PCT Filed: May 23, 2002
PCT No.: PCT/JP02/05013
371(c)(1),(2),(4) Date: October 09, 2003
PCT Pub. No.: WO02/096175
PCT Pub. Date: November 28, 2002


Foreign Application Priority Data

May 24, 2001 [JP] 2001-154960
Apr 24, 2002 [JP] 2002-121934

Current U.S. Class: 455/575.1 ; 257/704; 330/66; 330/68; 361/688; 361/709; 361/719; 361/752; 361/816; 455/128; 455/575.8
Current International Class: H04M 1/00 (20060101); H05K 7/20 (20060101)
Field of Search: 455/572,575.1,575.5,575.8,128,217,346,347 361/687,688,709,714,718,719,720,724,818,816,753,752,757 330/66,68 257/704


References Cited [Referenced By]

U.S. Patent Documents
5379185 January 1995 Griffin et al.
5552636 September 1996 Darveaux
5633786 May 1997 Matuszewski et al.
5748455 May 1998 Phillips et al.
6025991 February 2000 Saito
6134110 October 2000 Langari
6198444 March 2001 Sailsman et al.
6501019 December 2002 Sato et al.
6504727 January 2003 Kitamura et al.
6600663 July 2003 Koleda
7061774 June 2006 Zhang
2002/0089380 July 2002 Fujioka et al.
Foreign Patent Documents
0 393 236 Oct., 1990 EP
0 506 122 Sep., 1992 EP
3-263901 Nov., 1991 JP
5-41586 Oct., 1993 JP
9-107203 Apr., 1997 JP
2624362 Apr., 1997 JP
2925475 May., 1999 JP
11-204970 Jul., 1999 JP

Other References

Microfilm of the specification and drawings annexed to the request of Japanese Utility Model application No. 56527/1998 (Laid-Open No. 160735/1989), (Toyo Communication Equipment Co., Ltd.), Nov. 8, 1989, Full text; Figs. 1, 2 (Family: none) with English translation. cited by other.

Primary Examiner: Vuong; Quochien B.
Assistant Examiner: Wendell; Andrew
Attorney, Agent or Firm: Wenderoth, Lind & Ponack, L.L.P.

Claims



The invention claimed is:

1. A portable power amplifier comprising: a printed board disposed in a shielding case, said shielding case including a side plate and a top plate for covering a component side of said printed board, said printed board having an end including a soldering section, and existing between said side plate and said soldering section is a space for being filled with solder via capillary action; a power amplifying device mounted to said printed board; and a heat resisting component disposed in a vicinity of said power amplifying device and coupled to said power amplifying device via heat conductive material.

2. The portable power amplifier according to claim 1, further comprising: a burr extending from said side plate toward said soldering section for being connected with said soldering section.

3. The portable power amplifier according to claim 2, wherein said top plate includes a part that is cut and bent, with said part being in contact with a top of said power amplifying device.

4. The portable power amplifier according to claim 3, further comprising: a high frequency circuit in a vicinity of said power amplifying device, wherein said top plate further includes (i) another part that is cut and bent, with said another part defining a partition between said power amplifying device and said high frequency circuit, and (ii) a hole, produced by the cutting and bending of said another part, that is on a power amplifying device side of said partition.

5. The portable power amplifier according to claim 4, further comprising: an air intake hole in a vicinity of said soldering section, said air intake hole being in said side plate on a high frequency circuit side of said partition; and an air outlet hole in a vicinity of said power amplifying device, said air outlet hole being in said top plate.

6. The portable power amplifier according to claim 5, wherein said side plate is rougher than said top plate.

7. The portable power amplifier according to claim 6, wherein said shielding case comprises a metallic outer case.

8. The portable power amplifier according to claim 2, further comprising: a high frequency circuit in a vicinity of said power amplifying device; a partition between said power amplifying device and said high frequency circuit; a hole, in said top plate, on a power amplifying device side of said partition; an air intake hole in a vicinity of said soldering section, said air intake hole being in said side plate on a high frequency circuit side of said partition; and an air outlet hole in a vicinity of said power amplifying device, said air outlet hole being in said top plate.

9. The portable power amplifier according to claim 8, wherein said high frequency circuit comprises a voltage controlling oscillator.

10. The portable power amplifier according to claim 2, further comprising: a voltage controlling oscillator in a vicinity of said power amplifying device.

11. The portable power amplifier according to claim 2, wherein said shielding case is metallic.

12. The portable power amplifier according to claim 1, wherein said top plate includes a part that is cut and bent, with said part being in contact with a top of said power amplifying device.

13. The portable power amplifier according to claim 1, further comprising: a high frequency circuit in a vicinity of said power amplifying device, wherein said top plate includes (i) a part that is cut and bent, with said part defining a partition between said power amplifying device and said high frequency circuit, and (ii) a hole, produced by the cutting and bending of said part, that is on a power amplifying device side of said partition.

14. The portable power amplifier according to claim 13, further comprising: an air intake hole in a vicinity of said soldering section, said air intake hole being in said side plate on a high frequency circuit side of said partition; and an air outlet hole in a vicinity of said power amplifying device, said air outlet hole being in said top plate.

15. The portable power amplifier according to claim 13, wherein said high frequency circuit comprises a voltage controlling oscillator.

16. The portable power amplifier according to claim 1, wherein said shielding case is metallic, and further comprising: a filter coupled to an output terminal of said power amplifying device, said filter including chip components, with at least one of said chip components being between said output terminal and grounding, and with said grounding being near said shielding case.

17. The portable power amplifier according to claim 16, wherein said filter includes a chip inductor coupled to said output terminal of said power amplifying device, with said chip inductor being reflow-soldered to said printed board.

18. The portable power amplifier according to claim 16, further comprising: a pattern inductor coupled to said output terminal of said power amplifying device.

19. The portable power amplifier according to claim 1, wherein said side plate is rougher than said top plate.

20. The portable power amplifier according to claim 2, wherein said top plate includes a part that is in contact with a top of said power amplifying device.

21. The portable power amplifier according to claim 1, wherein said shielding case includes a first hole and a second hole, with said power amplifying device being positioned between said first hole and said second hole so as to be cooled by air entering said first hole and exiting said second hole.

22. The portable power amplifier according to claim 1, further comprising: an audio input device; and an audio output device disposed above said audio input device, wherein said power amplifying device is between said audio input device and said audio output device.

23. The portable power amplifier according to claim 1, further comprising: a chip capacitor between a power control terminal of said power amplifying device and grounding.

24. The portable power amplifier according to claim 1, further comprising: a chip capacitor between a power supply terminal of said power amplifying device and grounding.

25. The portable power amplifier according to claim 1, further comprising: an impedance matching circuit coupled to an input terminal of said power amplifying device, said impedance matching circuit including a pattern inductance.

26. The portable power amplifier according to claim 1, further comprising: an impedance matching circuit coupled to an input terminal of said power amplifying device, said impedance matching circuit including chip components that are reflow-soldered.

27. The portable power amplifier according to claim 1, further comprising: a dc cut-off chip capacitor coupled in series to an input terminal of said power amplifying device.

28. The portable power amplifier according to claim 1, wherein said shielding case is metallic, and further comprising: a grounded chip component, with grounding for said chip component being near said shielding case.

29. The portable power amplifier according to claim 1, wherein said shielding case comprises an outer case.
Description



TECHNICAL FIELD

The present invention relates to portable power amplifiers to be used in portable apparatuses.

BACKGROUND ART

A conventional portable power amplifier used in portable apparatuses is a simple one because the apparatuses are portable, which regulates a specification of their power amplifiers, so that the power amplifier is not a large size, or does not dissipate heat efficiently. To be specific, as shown in FIG. 7, power amplifying device 2 is mounted on an upper face of printed board 1 disposed in a portable outer case typically used in a portable phone. Heat generated from amplifying device 2 travels through through-holes 3 and is dissipated from pattern 4 prepared on a rear face of printed board 1. However, in this conventional structure, pattern 4 is limited in size as a heat-sink and cannot dissipate heat sufficiently. A use of a dedicated large heat-sink would enlarge the apparatus and make it unfit for portable use.

SUMMARY OF THE INVENTION

A portable power amplifier comprising the following elements is provided:

a portable outer case;

a printed board disposed in the outer case;

a power amplifying device mounted to the printed board; and

a heat resisting component disposed close to the amplifying device and coupled to the amplifying device via heat conductive material.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 shows a sectional view of an essential part of a portable power amplifier in accordance with a first exemplary embodiment of the present invention.

FIG. 2 shows a sectional view of an essential part of a portable power amplifier in accordance with a second exemplary embodiment of the present invention.

FIG. 3 shows a sectional view of an essential part of a portable power amplifier in accordance with a third exemplary embodiment of the present invention.

FIG. 4 shows a sectional view of an essential part of a portable phone employing the portable power amplifier in accordance with the third exemplary embodiment of the present invention.

FIG. 5 is a block diagram illustrating a vicinity of a power amplifying device in accordance with a fourth exemplary embodiment of the present invention.

FIG. 6 is a block diagram of a portable phone employing a portable power amplifier of the present invention.

FIG. 7 shows a sectional view of an essential part of a conventional portable power amplifier.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Exemplary embodiments of the present invention are demonstrated hereinafter, using a portable phone that employs a portable power amplifier, with reference to FIG. 1 through FIG. 6.

Exemplary Embodiment 1

FIG. 6 shows a block diagram of a portable phone employing a portable power amplifier in accordance with a first embodiment of the present invention. In FIG. 6, antenna 11 is coupled to a common terminal of antenna switch 12, which has three outputs and one input switchable upon request. A first output from switch 12 is supplied to first quadrature demodulator 15 of GSM (Global System for Mobile communication) band via band pass filter 13 that passes signals of GSM band (900 MHz) and via low noise amplifier (LNA) 14. First demodulator 15 supplies its output to DC offset canceler 16. A first output from voltage control oscillator (VCO) 17 is supplied to another input terminal of first demodulator 15.

A second output from antenna switch 12 is supplied to second quadrature demodulator 20 of DCS band (1800 MHz) via band pass filter 18 that passes signals in the DCS band and via LNA 19. Then demodulator 20 supplies its output to DC offset canceler 16. A second output from VCO 17 is supplied to another input terminal of second quadrature demodulator 20.

A third output from antenna switch 12 is supplied to third quadrature demodulator 23 of PCS band (1900 MHz) via band pass filter 21 that passes signals of the PCS band and via LNA 22. Demodulator 23 supplies its output to DC offset canceler 16. A third output from VCO 17 is supplied to another input terminal of third quadrature demodulator 23.

An output from DC offset canceler 16 is supplied to processing circuit 24 that includes a base-band signal processing circuit, an AD conversion circuit and a DA conversion circuit. An output from processing circuit 24 is supplied to PLL circuit 26 via quadrature demodulator 25. An output from PLL circuit 26 is supplied to VCO 17 for controlling VCO 17. An output from VCO 17 is supplied to an input terminal of antenna switch 12 via power amplifying device (hereinafter referred to simply as PA) 27. An output level of PA 27 is detected by power detection circuit 28, and fed back to processing circuit 24.

PA 27 amplifies an input of ca. 3 mW approximately 1300 times and outputs a signal of ca. 4 W. PA 27 thus needs a large power, and its heat dissipation capacity is raised as a problem in order to gain output efficiently. The present invention addresses mainly PA 27, VCO 17, antenna switch 12 and the vicinity of antenna 11.

FIG. 1 shows a sectional view of an essential part of the portable power amplifier in accordance with a first exemplary embodiment of the present invention. In FIG. 1, PA 27, antenna switch 12, connector 32 coupled to antenna 11 and VCO 17 are mounted on a surface of printed board 31. Metallic partition plate 33 is vertically disposed between PA 27 and VCO 17 and separates VCO 17 thermally from PA 27 for preventing VCO 17 from adversely influencing PA 27 with its frequency deviation, level changes, phase noises, and oscillation stop.

Heat generated from PA 27 travels to pattern 35 (used as an example of heat conductive material) formed on a rear face of printed board 31 via through-holes 34. Pattern 35 is disposed adjacent to a heat resisting outer case of antenna switch 12 as well as to antenna switch 12 per se, and is coupled to heat resisting connector 32.

As such, antenna switch 12 and connector 32 are placed close to PA 27, thereby reducing heat resistance of pattern 35. As a result, antenna 11 and antenna switch 12 can efficiently dissipate heat of PA 27. Pattern 35 is preferably as wide or thick as possible in order to reduce its heat resistance. The number of through-holes 34 is preferably as many as possible because of the same reason.

In a case that a multi-layer board is used as printed board 31, pattern 35 is preferably prepared as a first layer so that heat resistance can be lowered. FIG. 1 does not show an outer case; however, a case covering printed board 31 is actually available. In this embodiment a rod antenna is used as antenna 11; however, an antenna formed of chip components can be used. Antenna 11 can be exposed from the outer case, and this exposure substantially increases a heat dissipation performance. A surface of pattern 35 is roughened in advance by buffing or chemical polishing, so that this pattern formed of copper foil dissipates heat with ease.

Chip capacitor 36 is mounted close to PA 27 and works to cut off a current or reduce noises of a power supply (capacitor 36 is hereinafter referred to as a bypass capacitor). Since capacitor 36 is placed close to PA 27, its capacitance can be changed by heat from PA 27. However, this change does not affect the work of capacitor 36 because capacitor 36 just cuts of a current or reduces noises. Thus, chip capacitor 36 placed close to PA 27 can dissipate heat from PA 27 without losing its high-frequency performance.

Exemplary Embodiment 2

FIG. 2 shows a sectional view of an essential part of a portable power amplifier in accordance with a second exemplary embodiment. In FIG. 2, soldering section 42 is disposed on a side face of printed board 41. Power amplifying device (PA) 27, antenna switch 12, and VCO 17 are mounted on a surface of printed board 41. Metallic shielding case 43 working as an outer case covers all components mounted on printed board 41. Heat generated from PA 27 travels to pattern 45 formed on a rear face of printed board 41 via through-holes 44. Pattern 45 is coupled to soldering section 42. As such, pattern 45 is coupled to heat resisting shielding case 43 via an outer case of antenna switch 12, antenna switch 12 per se and soldering section 42.

Heat generated from PA 27 can be dissipated efficiently from shielding case 43 prepared for shielding electronics components, the outer case of antenna switch 12, and antenna switch 12 per se.

Pattern 45 is preferably as thick or wide as possible in order to reduce its heat resistance. The number of through-holes 44 is preferably as many as possible for the same reason. Antenna switch 12 is disposed close to soldering section 42 and adjacent to PA 27. In a case that a multi-layer board is used as printed board 41, pattern 45 is preferably prepared as a first layer so that heat resistance can be lowered. In FIG. 2, no outer case is shown; however, an outer case for covering the shielding case 43 is actually available.

Top plate 47 of shielding case 43 at PA 27 side is bent, thereby forming partition plate 48, which separates VCO 17 thermally from PA 27. This separation can reduce adverse influence from VCO 17 such as frequency deviation, level changes, phase noises, and oscillation stop. Hole 49 is formed on shielding case 43 at PA 27 side, and this hole 49 can dissipate heat from PA 27.

Part of top plate 47 of shielding case 43 above PA 27 is cut and bent to form slip 50, then slip 50 is elastically urged against a top plate of PA 27. This structure allows shielding case 43 to dissipate heat directly from PA 27, thereby obtaining an advantage of heat-dissipation.

Further, side face 46 of shielding case 43 is roughened, thereby enlarging a surface area for increasing a heat dissipation efficiency. Top plate 47 is smoother than side face 46 and can be sucked with a nozzle, thereby allowing handling of the amplifier with ease, and case 43 looks fine on the top plate.

Burr 51 is formed at an end of side face 46 toward soldering section 42, so that space 52 is produced between side face 46 and soldering section 42. Therefore, space 52 is positively filled with solder due to a capillary action during soldering, so that soldering section 42 is jointed with shielding case 43 with a large area. As a result, heat resistance due to a joint between pattern 45 and case 43 is reduced, and heat dissipation thus can be increased.

In manufacturing shielding case 43, a metal plate is cut by punching, thereby forming burr 51 at the end of side face 46, then the plate is bent at a right angle in a cutting direction, so that side face 46 is formed.

Intake hole 53 is prepared on case 43, for outer air to flow-in, near to VCO 17 at soldering section 42 side. Outlet hole 54 is prepared on case 43 near to PA 27. Cool outer air flows in through intake hole 53, thereby cooling VCO 17 that has been warmed by PA 27. Then the air flows out through outlet hole 54. This structure prevents VCO 17 from lowering its performance (such as degradation of phase noises, oscillation stop, or frequency deviation) due to heat.

Exemplary Embodiment 3

FIG. 3 shows a sectional view of essential parts of a portable phone in accordance with a third exemplary embodiment. In FIG. 3, power amplifying device (PA) 27, antenna switch 12, and VCO 17 are mounted on a surface of printed board 61. Heat resisting encapsulating cases 62 and 63 cover all components mounted on printed board 61. Heat generated from PA 27 travels to heat conductive pattern 65 formed on a rear face of printed board 61 via through-holes 64. Pattern 65 is coupled to encapsulating cases 62 and 63 to which heat conductive material is attached, so that pattern 65 is thermally coupled to overall surfaces of encapsulating cases 62 and 63. As a result, pattern 65 is coupled to an outer case of antenna switch 12 disposed adjacent to PA 27 and encapsulating cases 62, 63 disposed adjacent to antenna switch 12.

The heat generated from PA 27 can be dissipated from encapsulating cases 62, 63 prepared for protecting electronics components. A placement of junction point 66 of antenna switch 12, encapsulating cases 62 and 63 close to PA 27 reduces a routing of pattern 65. Then heat resistance is lowered, and heat of PA 27 can be dissipated efficiently from encapsulating cases 62, 63 and antenna switch 12. Pattern 65 is preferably as thick as possible in order to reduce its heat resistance. The number of through-holes 64 is preferably as many as possible for the same reason. In a case that a multi-layer board is used as printed board 61, heat conductive pattern 65 is preferably prepared as a first layer so that heat resistance can be lowered.

FIG. 4 shows a sectional view of essential parts of a portable phone in accordance with the third embodiment. In FIG. 4, first hole 71 is provided in encapsulating case 63 such that hole 71 faces audio input device 70, and second hole 73 is provided in outer case 63 such that hole 73 faces audio output device 72. Power amplifying device (PA) 27 is prepared between audio input device 70 and audio output device 72.

The portable phone discussed above is used such that audio input device 70 is brought close to a user's mouth and audio output device 72 is brought close to the user's ear. As a result, audio input device 70 takes its place below PA 27 and audio output device 72 takes its place above PA 27 when the portable phone is in use. First hole 71 and second hole 73 are thus placed such that they face audio input device 70 and audio output device 72 respectively. Therefore, air flows in through first hole 71 opposite to audio input device 70, and flows out through second hole 73 opposite to audio output device 72. This mechanism allows open air to flow into outer cases 62 and 63 through first hole 71 of audio input device 70, and heated air to flow out through second hole 73 of audio output device 72, so that PA 27 can be cooled.

Providing PA 27 with spaces 52 shown in FIG. 2 above and below PA 27 will further cool PA 27.

Exemplary Embodiment 4

FIG. 5 is a block diagram illustrating a vicinity of the portable power amplifier in accordance with a fourth exemplary embodiment. In FIG. 5, an output from VCO 17 is supplied to input terminal 80 of power amplifying device (PA) 27. Input terminal 80 is coupled to a first matching circuit formed of inductor 81 and chip capacitor 82. Inductor 81 is connected to PA 27 in series, and chip capacitor 82 is connected to PA 27 in parallel. The first matching circuit determines constants such that impedance of VCO 17 is matched with PA 27.

An output from PA 27 is supplied to a second matching circuit formed of inductor 83 and chip capacitor 84. Inductor 83 is coupled to PA 27 in series, and chip capacitor 84 is coupled to PA 27 in parallel.

In this fourth embodiment, chip capacitors 82 and 84 are reflow-soldered, so that they take advantage of a self-alignment effect of reflow soldering. As a result, capacitors 82 and 84 are accurately soldered onto given positions of a pattern free from unnecessary inductance. Thus, an excellent power amplifying can be expected, and a portable power amplifier of superb characteristics is obtainable.

An output from the second matching circuit is supplied to directional coupler 85, of which a first output is supplied to output terminal 87 via low pass filter 86. Output terminal 87 is coupled to an input terminal of antenna switch 12. A second output from directional coupler 85 is supplied to automatic power control circuit 88, of which an output is supplied to power control terminal 27a of PA 27.

Control terminal 89 regulates an amplification degree of PA 27 from outside and is coupled to automatic power control circuit 88. Control terminal 90 controls on-off of power supply of PA 27 from outside and is coupled to an input terminal of circuit 88 and also coupled to power supply control terminal 27b of PA 27 via circuit 88.

Between circuit 88 and power control terminal 27a, grounded chip capacitor 91 is coupled, and between circuit 88 and power supply control terminal 27b grounded chip capacitor 92 is coupled. These capacitors 91 and 92 can attenuate noises riding on terminals 27a and 27b, and since these two capacitors are placed close to PA 27, they can dissipate heat generated from PA 27.

Chip capacitors 91 and 92 are reflow-soldered and thus heat resistive, therefore, they can be used close to PA 27 without any problem. Since chip capacitors 91 and 92 are used to attenuate noises, a function of attenuating high-frequency noises is not damaged even if capacitance is somewhat varied by heat from PA 27, and a stable amplification is obtainable.

Chip capacitors 82 and 84 are elements of first and second matching circuits respectively. Respective ones of electrodes of capacitors 82 and 84 are grounded near to shielding case 47 as shown in FIG. 2. This structure allows heat of PA 27 to dissipate from shielding case 47 via the grounding and capacitors 82 and 84.

This structure also suppresses temperatures of capacitors 82 and 84 from rising, so that changes of impedance of the matching circuits due to temperature drift can be suppressed. As a result, a signal loss due to heat generated from Pa 27 can be minimized.

Instead of the second matching circuit, low pass filter 86 can be directly coupled to an output terminal of PA 27. In this case, a chip capacitor that is an element of filter 86, and of which one of the electrodes is grounded, is preferably placed close to shielding case 47. This chip capacitor is reflow-soldered and thus accurately positioned, which assures production of a low pass filter having a stable cut-off frequency and that is less affected by temperature.

Instead of chip inductor 81, 83, a pattern inductor can be used. And an inductor that is an element of low pass filter 86 can be used as a pattern inductor. In this case, the pattern inductor can dissipate heat, and is strong enough to withstand vibrations or shocks. Further, it can be adjusted to a given inductance by laser trimming, so that an accurate portable power amplifier is obtainable.

In a case when input terminal 80 receives an output from an oscillator of an open-collector, a dc is applied to terminal 80 in order to power the oscillator. In this case the dc should be prevented from being applied to PA 27, so that a dc cut-off capacitor is disposed between input terminal 80 and PA 27. Since this capacitor can just cut off the dc, it keeps working even if heat from PA 27 changes its capacitance somewhat. This dc cut-off capacitor is inserted between input terminal 80 and PA 27, so that it is placed close to PA 27, thereby dissipating heat of PA 27.

As discussed above, the portable power amplifier of the present invention comprises the following elements:

a portable outer case;

a printed board disposed in the outer case; and

a power amplifying device mounted to the printed board.

A heat resisting component is disposed in the vicinity of the power amplifying device, and coupled to the power amplifying device via heat conductive material, so that the heat resisting component has two functions; namely, the component as itself and as a heat sink. As a result, heat can be well dissipated and also the portable power amplifier can be downsized without having an independent heat sink that would enlarge the portable power amplifier.

Since the power amplifying device is mounted on a printed board, a printed pattern can be fully utilized as heat conductive material, so that the portable power amplifiers can be manufactured with ease. The structure discussed above allows eliminating a heat sink from the printed board, so that wiring can be designed with ease and the number of components can be reduced.

INDUSTRIAL APPLICABILITY

The present invention relates to a portable power amplifier to be used in portable apparatuses, and aims to provide a portable power amplifier that can dissipate heat efficiently and can be fit in the portable apparatuses without changing sizes of the apparatuses.

*


Free Web Sudoku Puzzles.
Solve with your browser.
          7 9    
  9 2 1 6        
8 4       3      
  5 3     9      
1 2           7 9
      2     8 5  
      5       2 6
        1 6 4 8  
    5 3          
What is it?



Add Your Site · Terms Of Service · Privacy Policy


DISCLAIMER
Linkgrinder is a free service that searches the Internet and indexes all files found so that you may search quickly and easily for shared files. These files are created and made available individually by users whose identity we are not aware of and who we have no control over. In essence we function like a search engine tool; these files ARE NOT STORED OR SERVED BY OUR NETWORK. We are not responsible for any materials obtained by using our service. We do not monitor any of the contents of these files. These files may contain viruses, illegal materials, materials inappropriate for minors, offensive files and the like. BY USING OUR SERVICE, YOU ASSUME FULL RESPONSIBILITY FOR DOWNLOADING THESE MATERIALS AND WILL INDEMNIFY US FOR ANY DAMAGES THAT MAY BE INCURRED.

For More Specific Information VIEW OUR TERMS OF SERVICE.

Thank you and Enjoy!